Textbooks and Multi-Media Materials
- Electronic
Packaging: Materials and Their Properties
by M. G. Pecht, R. Agarwal, P. McCluskey, T. Dishongh, S. Javadpour, and
R. Mahajan
CRC Press LLC, Washington, DC, 1999.
- Influence
of Temperature on Microelectronics and System Reliablity: A Physics of
Failure Approach
by Pradeep Lall, Motorola, Michael Pecht, CALCE, and Edward Hakim, U.S.
Army
CRC Press, New York, NY, 1997.
- High
Temperature Electronics
edited by F. Patrick McCluskey, R. Grzybowski, and T. Podlesak
CRC Press, Inc., New York, NY, 1997.
- Product
Reliability, Maintainability, and Supportability Handbook
edited by M. Pecht
CRC Press, New York, NY, 1995.
- Plastic
Encapsulated Microelectronics
edited by M. Pecht, Luu T. Nguyen, Edward B. Hakim
John Wiley & Sons,New York, NY, 1994.
- Semiconductor
Packaging: A Multidisciplinary Approach
edited by A. Kraus, R. Hannemann and M. Pecht
John Wiley & Sons, New York, NY, 1994.
- Soldering
Processes and Equipment
edited by M. Pecht
John Wiley & Sons, New York, NY, July 1993.
- Handbook
of Electronic Package Design
edited by M. Pecht
Marcel Dekker, Inc., New York, NY, 1991.
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