Influence
of Temperature on Microelectronics and System Reliability:
A Physics of Failure Approach
Various sections of the book address the steady state and cyclic temperature effects on electrical parameters and the reliability of both bipolar and MOSFET devices; identify models quantifying the temperature effects on package elements; and address the impacts of various design for temperature trade-offs on electronic systems. Temperature-related models are assessed in terms of their use for determining the maximum and minimum allowable temperature stresses for a given system architecture. Derating methods are also reviewed.
Features
- Presents the effect of temperature in the context of microelectronics reliability, covering damage mechanisms in the temperature range of -55°C to 150°C.
- Uses the cumulative effect of competing failure processes on device life to determine appropriate values of operating temperature and non-temperature related stress.
- Derives stress margin curves for device life for mechanisms with dependencies on stresses and defects.
- Assists the reader in evaluating the life cycle reliability, cost, and weight trade-offs associated with cooling.
Catalog number: 9450
May 1996, c., ISBN: 0-8493-9450-3
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