CALCE ALUMNI
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2017
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M.S.
Nathan Valentine (Stanley Black and Decker, MD)
M.S. Mechanical Engineering
Failure Modes and Mechanisms Analysis of Silicon Power Devices
Advisors: Prof. Michael Pecht and Dr. Diganta Das
Tyler Formica (Raytheon, MA)
M.S. Mechanical Engineering
The Effectiveness of Warranties in the Solar Photovoltaic and Automotive Industries
Advisor: Prof. Michael Pecht
Ph.D.
Yan Ning (Dell, TX)
Ph. D. Mechanical Engineering
Reliability of Copper-Filled Stacked Microvias in High Density Interconnect Circuit Boards
2016
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M.S.
James Twomey (Naval Sea Logistics Center, Mechanicsburg, PA)
M.S. Mechanical Engineering
Development of an Off-Line Rainflow Counting Algorithm with Temporal Parameters and Data Reduction
Advisor: Prof. Michael Pecht
Daniel Power (Northrop Grumman, MD)
M.S. Mechanical Engineering
A Thermal Management Solution for Compact Power Converters
Advisor: Prof. Patrick McCluskey
Helmut Bevensee (Aerojet Rocketdyne, CA)
M.S. Mechanical Engineering
The Effect of Package Geometry on Moisture Driven Degradation of Polymer Aluminum Capacitors
Advisor: Dr. Michael Azarian
Ph.D.
Dae-Suk Kim (PostDoc, UMD)
Ph.D. Mechanical Engineering
Comprehensive Electrical/Optical/Thermal Characterization Of High Power Light Emitting Diodes And Laser Diodes
Advisor: Prof Bongtae Han
Kenny Mahan (Apple, CA)
Ph.D. Mechanical Engineering
Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems
Advisor: Prof. Bongtae Han
Yong Sun (Intel, AZ)
Ph.D. Mechanical Engineering
Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages
Advisor: Prof. Bongtae Han
Arvind Vasan (Empower Micro,CA)
Ph.D. Mechanical Engineering
Advisor: Prof. Michael Pecht
2015
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Ph.D.
Jingshi Meng (Apple, CA)
Ph.D. Mechanical Engineering
Multi-scale Dynamic Study of Secondary Impact during Drop Testing of Surface Mount Packages
Advisor: Prof. Abhijit Dasgupta
Sandeep Menon (Oracle,CA)
Ph.D. Mechanical Engineering
An Analytical Approach for Fatigue Life Estimation of Copper Traces for Design Optimization in Electronic Assemblies
Advisor: Prof. Michael Pecht
Elviz George (Oracle,CA)
Ph.D. Mechanical Engineering
A Non-Linear Damage Model with Load Dependent Exponents for Solders Under Sequential Cyclic Shear Loads
Advisor: Prof. Michael Pecht
Subhasis Mukherjee (SanDisk)
Ph.D. Mechanical Engineering
Multiscale Modelling of Anisotropic Creep Response of SnAgCu Single Crystal
Advisor: Prof. Abhijit Dasgupta
Sony Mathew (Schlumberger)
Ph.D. Mechanical Engineering
An Analytical Model for Developing a Canary Device
Advisor: Prof. Michael Pecht
M.S.
Dinesh Michael Mahadeo (Sandia National Laboratories)
M.S. Mechanical Engineering
Copper Corrosion in the Flowers of Sulfer Test Environment
Advisor: Prof. Michael Pecht
Sumeer Khanna
M.S. Mechanical Engineering
Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics
Advisor: Prof. Patrick McCluskey
2014
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Ph.D.
Anshul Shrivastava (Rockwell Automation, WI)
Ph.D. Mechanical Engineering
Reliability Evaluation of Liquid and Polymer Aluminum Electrolytic Capacitors
Advisor: Prof. Michael Pecht
Gary Paradee (Intel, OR)
Ph.D. Mechanical Engineering
Fatigue Properties of Graphene Interconnects on Flexible Substrates
Advisor: Prof. Aris Christou
Chandradip Patel (Schlumberger, TX)
Ph.D. Mechanical Engineering
Performance Assessment of Mems Gyroscope and Shock Durability Evaluation af SAC305-X Solders for High Temperature Applications
Advisor: Prof. Patrick McCluskey
Moon-Hwan Chang (Samsung Display Co. Ltd.)
Ph.D. Mechanical Engineering
Prognostics-based Qualification of White Light-Emitting Diodes
Advisors: Prof. Michael Pecht and Prof. Bilal Ayyub
M.S.
Josh Akman
M.S. Mechanical Engineering
Numerical Parametric Study of the Thermomechanical Effect of Encapsulation on a Welded Beam Lead Component
Advisor: Prof. Abhijit Dasgupta
Adam Pearl (NAVAIR - MD)
M.S. Mechanical Engineering
Effect of Palladium Thickness and Extended Isothermal Aging on the Reliability of Solder Interconnects Formed on ENEPIG Surface Finish
Advisors: Prof. Michael Pecht and Dr. Michael Osterman
Christopher John Bilger
M.S. Mechanical Engineering
Mechanical and electrical properties of metal-carbon connections for battery applications
Advisor: Prof. Hugh Bruck
Ehsan Parsa(Advanced Bionics)
M.S. Mechanical Engineering
Effect of Encapsulation on Electrolyte Leakage in Aluminum Electrolytic Capacitors Under Constant Thermal and Electrical Loading
Advisor: Prof. Abhijit Dasgupta
Stephen Junho Kang
M.S. Mechanical Engineering
Adhesion Strength Measurement of Multilayer Structures with Vertical Crack by Four Point Bending Test
Advisor: Prof. Bongtae Han
Jared Michael Levy
M.S. Mechanical Engineering
Simulation and Analysis of Energy Consumption for an Energy-Intensive Academic Research Building
Advisor: Prof. Michael Ohadi
Hannah Allison
M.S. Mechanical Engineering
A Simulation Approach to Modeling Contingency Strategies for Managing Electronic Part Supply Chain Disruptions
Advisor: Prof. Peter Sandborn
2013
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Ph.D.
Bo Song (Phillips Healthcare, MA)
Ph.D. Mechanical Engineering
Impact of Dust on the Reliability of Printed Circuit Assemblies
M.S. Mechanical Engineering - 2006
Reliability Evaluation of Stacked Die BGA Assemblies under
Mechanical Bending Loads
Fei Chai (Intel, AZ)
Ph.D. Mechanical Engineering
Solder Interconnect Life Prediction under Complex Temperature Cycling with Varying Mean and Amplitude
Advisor: Prof. Michael Pecht
He Xiaofei (Apple, CA)
Ph.D. Mechanical Engineering
Evaluation and Modeling of Electrochemical Migration on Printed Circuit Boards
Advisors: Prof. Michael Pecht and Dr. Michael Azarian
M.S.
Edwin Sutrisno (Schlumberger, TX)
M.S. Mechanical Engineering
Fault Detection and Prognostics of Insulated Gate Bipolar Transistor (IGBT) Using a K-Nearest Neighbor Classification Algorithm
Advisor: Prof. Michael Pecht
Edwin Lillie (Intel, AZ)
M.S. Mechanical Engineering
Assessing the Cost of Risk for New Technology and Process Insertion
Advisor: Prof. Peter Sandborm
Robert Boettcher
M.S. Mechanical Engineering
Arcing Failure of RoHS Compliant Electromagnetic Relays
Advisor: Prof. Patrick McCluskey
Thomas Fritzler (Soraa)
M.S. Mechanical Engineering
Scintillation Conditioning of Tantalum Capacitors with Manganese Dioxide Cathodes
Advisors: Prof. Michael Pecht and Dr. Michael Azarian
Roozbeh Bakhshi (PhD Student, University of Maryland, College Park)
M.S. Mechanical Engineering
Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo-Mechanical Stresses
Advisors: Prof. Michael Pecht and Dr. Michael Azarian
Surya Tej Kunche (Nordson Asymtek, CA)
M.S. Mechanical Engineering
Classifier Fusion Technique for Fault Diagnostics
Advisor: Prof. Michael Pecht
David Squiller
M.S. Mechanical Engineering
Methods and Models for Assessing Solder Interconnect Reliability of Control Boards in Power Electronic Systems
Advisor: Prof. Patrick McCluskey
2012
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Ph.D.
Preeti Chauhan (Intel, AZ)
Ph.D. Mechanical Engineering
Thermal Cycling Reliability of SAC305, SAC105, SN100C and SnPb Solders under Isothermal Aging
Advisor: Prof. Michael Pecht
Jun Dai (Electro-Motive Diesel, IL)
Ph.D. Mechanical Engineering
Risk Assessment and Mitigation of Telecommunication Equipment under Free Air Cooling Conditions
Advisor: Prof. Michael Pecht
Sung-Won Han (Samsung)
Ph.D. Mechanical Engineering
Assessment of Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers
Raymond Nelson III (WILLCOR Inc., MD)
Ph.D. Mechanical Engineering
Concurrent Multi-Part Multi-Event Design Refresh Planning Models Incorporating Solution Requirements and Part-Unique Temporal Constraints
Hyunseok Oh (Seoul National University)
Ph.D. Mechanical Engineering
Prognostics of Ball Bearing based on Vibration and Acoustic Emission Analysis
Advisor: Prof. Michael Pecht
Koustav Sinha (Fujitsu, TX)
Ph.D. Mechanical Engineering
Mechanics of Non Planar Interfaces in Flip-Chip Interconnects
Advisor: Prof. Abhijit Dasgupta
Amer Charbaji (Beam International)
M.S. Mechanical Engineering
Influence of Varying H2S Concentrations and Humidity Levels on ImAg and OSP Surface Finishes
2011
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Ph.D.
Lauren Boteler (Army Research Laboratory)
Ph.D. Mechanical Engineering
Microfabrication And Analysis Of Manifold Microchannel Coolers For Power Electronics
Advisor: Prof. Michael Pecht
Shunfeng Cheng (Intel, OR)
Ph.D. Mechanical Engineering
Prognostics and Health Management
Advisor: Prof. Michael Pecht
Gilbert Haddad (GE, CA)
Ph.D. Mechanical Engineering
Decision Support for Systems with Prognostic Capabilities
Advisors: Prof. Peter Sandborn and Prof. Michael Pecht
Taoufik Jazouli
Ph.D. Mechanical Engineering
Design for Availability and PHM Cost Modeling
Advisor: Prof. Peter Sandborn
Sharon, Gil
Ph.D. Mechanical Engineering
Improved Flex Cracking Calculator and Failure Analysis for Multilayer Ceramic Capacitors
Vasilis Sotiris (Barclays)
Ph.D. Applied Mathematics
Stochastic Processes, Probability Theory, and Data Driven Prognostics
Advisors: Prof. Michael Pecht and Prof. Eric Slud
M.S.
Crandall, Mike
M.S. Mechanical Engineering
High Temperature Lead Free Solder
Williard, Nick
M.S. Mechanical Engineering
2010
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Ph.D.
Vidyu Challa
Ph.D. Mechanical Engineering
Effect of Joule heating on the reliability of stamped metal land grid array sockets
Advisor: Prof. Michael Pecht
Gayatri Cuddalorepatta(Harvard University, MA)
Ph.D. Mechanical Engineering
Evolution of the microstructure and viscoplastic behavior of miroscale SAC305 solder joints as a function of mechanical fatigue damage
Advisor: Prof. Abhijit Dasgupta
Daniel Farley (Post-doctoral Researcher, Technical University of Delft)
Ph.D. Mechanical Engineering
Development of fatigue models for copper traces on printed wiring assemblies under quasi-static cyclic mechanical bending
Advisor: Prof. Abhijit Dasgupta
Patrice Gregory(Sandia National Lab, Albuquerque, New Mexico)
Ph.D. Mechanical Engineering
Comparison of interconnect failures of electronic components mounted on Fr-4 boards with Sn37Pb and Sn3.0Ag0.5Cu solders under rapid loading conditions
Advisor: Prof. Donald Barker
Daeil Kwon(Assistant Professor, Ulsan National Institute of Science and Technology, Korea )
Ph.D. Mechanical Engineering
Detection of Interconnect Failure Precursors Using RF Impedance Analysis
Advisor: Prof. Michael Pecht
Nishad Patil (Intel, OR)
Ph.D. Mechanical Engineering
Prognostics of Insulated Gate Bipolar Transistors
Advisor: Prof. Michael Pecht
Wang, Yong (Microsoft)
Ph.D. Mechanical Engineering
Integrated Measurement Technique To Measure Curing Process-dependent Mechanical And Thermal Properties Of Polymeric Materials Using Fiber Bragg Grating Sensors
M.S.
Stuart Douglas (Google)
M.S. Mechanical Engineering
High accelerations Produced Through Secondary Impact and Its Effect on Reliability of Printed Wiring Assemblies
Advisor: Prof. Abhijit Dasgupta
Elviz George (PhD Student, University of Maryland)
M.S. Mechanical Engineering
Reliability of Lead-Free Solders under High Temperature Thermal Cycling
Advisor: Prof. Michael Pecht
Rubyca Jaai (PhD Student, University of Maryland)
M.S. Mechanical Engineering
Fusion Prognostics Methodology for Prognostics and Systems Health Management
Advisor: Prof. Michael Pecht
Beth Paquette (NASA, MD)
M.S. Mechanical Engineering
Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards with SAC305 and Eutectic SnPb Solder
Advisor: Prof. Donald Barker
Vikram Srinivas (Lab126, CA)
M.S. Mechanical Engineering
Mechanical Testing of Printed Wiring Assemblies with Experience in Torsional Load; Bend Load and Vibration Load (Random, Sinusoidal and Classical Shock) Testing to Evaluate Second-Level Interconnects Reliability
Advisor: Prof. Michael Pecht
Laura Woodworth (CIA, VA)
M.S. Mechanical Engineering
Characterization of Time and Temperature Dependent Mechanical Properties of Advanced Polymers Using Bragg Grating Sensors
Advisor: Dr. Bongtae Han
2009
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Ph.D.
Yuxun Zhou (Google, CA)
Ph.D. Mechanical Engineering
Harmonic and Random Vibration Durability Investigation for SAC305 (Sn3.0Ag0.5Cu) Solder Joint
Advisor: Prof. Abhijit Dasgupta
Jie Gu (Apple, CA)
Ph.D. Mechanical Engineering
Prognostics of Solder Joint Reliability Under Vibration Loading Using Physics of Failure Approach
Prof. Michael Pecht and Prof. Donald Barker
Vinh Khuu (Mitre Corporation, VA)
Ph.D. Mechanical Engineering
Evaluation of Thermal Interface Materials and the Laser Flash Method
Advisor: Prof. Michael Pecht
Sachin Kumar (ASML, CT)
Ph.D. Mechanical Engineering
Prognostic and Health Management of Electronic Products
Leoncio Lopez
Ph.D. Mechanical Engineering
Quality and Reliability of Land Grid Array Sockets
Advisor: Prof. Michael Pecht
Lei Nie (Apple, CA)
Ph.D. Mechanical Engineering
Reliability of Reballed and Reworked Ball Grid Array Packages in SNPB and SAC Assembly
Advisor: Prof. Michael Pecht
M.S.
Alex F. Askari (U.S. Navy, MD)
M.S. Mechanical Engineering
Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
Advisor: Prof. Abhijit Dasgupta
Garry Brock(Graduate Student, Cornell University)
M.S. Mechanical Engineering
Reliability of Multilayer Ceramic Capacitors
Advisor: Prof. Michael Pecht
Rachel Emmel (General Dynamics - AIS)
M.S. Mechanical Engineering
Development of a Test Metohdology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structures
Advisor: Prof. Donald Barker
Yasir Majeed (PhD Student, University of Maryland)
M.S. Mechanical Engineering
Thermo-Mechanical Design Study of Fiber Optic Pressure Sensor Diaphragms
Advisor: Prof. Abhijit Dasgupta
Lyudmyla Panashchenko (NASA Goddard, MD)
M.S. Mechanical Engineering
Evaluation of Environmental Tests for Tin Whisker Assessment
Advisor: Prof. Michael Osterman
Shaughn M. Roettele (JHU-APL, MD)
M.S. Mechanical Engineering
Probabilistic Physics of Failure Assessment of Thermomechanical
Fatigue of High-I/O Area-Array Interconnects
Advisor: Prof. Abhijit Dasgupta
Weiqiang Wang (Baker Hughes, TX)
M.S. Mechanical Engineering
Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb)
SMT Packages under Temperature Cycling Test
Advisor: Prof. Michael Pecht
2008
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Ph.D.
Hongbo Bi (CGGVeritas)
Ph.D. Mechanical Engineering
Development Of Displacement Measurement Technique For Nano-Scale Structures
Advisor: Dr. Bongtae Han
Arindam Goswami (Apple, CA)
Ph.D. Mechanical Engineering
Quantitative Hermeticity Assessment of Packages with Micro to Nano-Liter Cavities
Advisor: Dr. Bongtae Han
Kevin A. Moores (U.S. Department of Defense, MD)
Ph.D. Mechanical Engineering - 2002
Thermal and Hydrodynamic
Investigation of Shrouded Pin Fin Heat Sinks With Liquid Cooling
Rui Wu (ASML Inc., CT)
Ph.D. Mechanical Engineering
Influence of Cryogenic Temperature and Microstructure on Fatigue Failure of Indium Solder Joint
Advisor: Prof. Patrick McCluskey
M.S.
Leah Pike (Johnson Space Flight Center, NASA, TX)
M.S. Mechanical Engineering
Gustavo Alberto Plaza (Schlumberger, TX)
M.S. Mechanical Engineering
Impact of Board Pad Finish on the SNPB and Lead-Free Solder Interconnect Reliability for Leadless Chip Resistors Under Random Vibration Loading
Advisor: Prof. Michael Pecht
Ravikumar Sanapala
(KLA-Tencor, India)
M.S. Mechanical Engineering
Characterization of FR-4 Printed
Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions
Advisor: Prof. Michael Pecht
2007
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Ph.D.
Anupam Choubey (Jet Propulsion lab, Pasadena, CA)
Ph.D. Mechanical Engineering
Microsturctural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints
Advisor: Prof. Michael Pecht
Jon Elerath (Jon Elerath Reliability Engineering Consulting)
Ph.D. Mechanical Engineering
Reliability Model and Assessment of Redundant Arrays of Inexpensive
Disks (RAID) Incorporating Latent Defects and Non-Homogenous Poisson Process Events
Advisor: Prof. Michael Pecht
M.S.
Dan Feng (Booz Allen Hamilton)
M.S. Mechanical Engineering
Optimizing Lifetime Buy Quantities To Minimize Lifecycle Costs
Advisor: Prof. Peter Sandborn
Jessica Myers (U.S. PTO)
M.S. Mechanical Engineering
Integration of Technology
Roadmapping Information into DMSMS-Driven Design Refresh Planning of
the V-22 Advanced Mission Computer
Advisor: Prof. Peter Sandborn
Brian Tuchband (Boeing, PA)
M.S. Mechanical Engineering
Implementation of Prognostics and Health Management for Electronic Systems
Advisor: Prof. Michael Pecht
2006
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Ph.D.
Manas Dash
(Philips Healthcare, MA)
Ph.D. Mechanical Engineering
Thermo-Mechanical Durability Assessment and Microstructural Characterization
Study of 95.5Pb2Sn2.5Ag High Temperature Solder
Advisor: Prof. Patrick McCluskey
Yuliang Deng (Knight Trailer Sales Inc., Canada)
Ph.D. Mechanical Engineering
Carbon Fiber Electronic Interconnect
Advisor: Prof. Michael Pecht
Leila Jannesari Ladani (Utah State University)
Ph.D. Mechanical Engineering
Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading
Advisor: Prof. Abhijit Dasgupta
Mohammedreza Keimasi (Force10 networks, CA)
Ph.D. Mechanical Engineering
Flex cracking and temperature-humidity-bias effects on reliability of multilayer ceramic capacitors
Advisor: Advisor: Prof. Michael Pecht
Yan Liu (Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering
Reduction of Skin Stretch Induced Motion Artifacts in Electrocardiogram Monitoring Using Adaptive Filtering
Haiyu Qi (Cameron International, TX)
Ph.D. Mechanical Engineering
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Thermal Cycling and Vibration Loading Conditions
Advisor: Prof. Michael Pecht
Joseph Varghese (Entrepreneur, India)
Ph.D. Mechanical Engineering
Drop Testing of Portable Electronic Devices
Advisor: Prof. Abhijit Dasgupta
Nikhil Vichare (Dell, TX)
Ph.D. Mechanical Engineering
Prognostics and Health management of Electronics by Utilizing Environmental and Usage Loads
Advisor: Prof. Michael Pecht
Mei-Ling Wu (National Cheng Kung University, Taiwan)
Ph.D. Mechanical Engineering
Dissertation: Rapid Assessment Methodology of BGA Fatigue Life under Vibration Loading
Advisor: Prof. Donald Barker
Sheng Zhan, (Baker Hughes, TX)
Ph.D. Mechanical Engineering
Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards
Advisor: Prof. Michael Pecht
M.S.
Krishna Kumar Jinka (entrepreneur, Hyderabad, India)
M.S. Mechanical Engineering
Thermo-mechanical Analysis of Encapsulated Ball-Wedge Wire Bonds in Microelectronics, using Raleigh-Ritz Modeling
Advisor: Prof. Abhijit Dasgupta
Shirsho Sengupta (Qualcomm, CA)
M.S. Mechanical Engineering
Effects of Solder-Dipping as A Termination Re-Finishing Technique
Advisor: Prof. Michael Pecht
Wang, Zhixiang
M.S. Mechanical Engineering
2005
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Ph.D.
Seungmin Cho
Ph.D. Mechanical Engineering
Development of Moiré Interferometry for Real-time Observation of Nonlinear Thermal Deformations of Solder and Solder Assembly
Advisor: Dr. Bongtae Han
Bevin Etienne
Ph.D. Reliability Engineering
The Development
of Cost and Size Analysis for the Assessment of Embedded Passives
in Printed Circuit Boards
Advisor: Prof. Peter Sandborn
Tong Fang (Vitesse, CA)
PH.D. Mechanical Engineering
Tin Whisker Risk Assessment Studies
Advisor: Prof. Michael Pecht
Yuki Fukuda (Polycom Inc., TX)
PH.D. Mechanical Engineering
Experimental Investigations of Whisker Formation on Tin Platings
Advisor: Prof. Michael Pecht
Changwoon Han (KETI, Korea)
Ph.D. Mechanical Engineering
Shadow Moir¨¦ Using Non-zero Talbot Distance and Application of Diffraction Theory to Moir¨¦ Interferometry
Yu-Chul Hwang (Samsung, Korea)
Ph.D. Materials and Nuclear Engineering
Electrostatic Discharge and Electrical Overstress Failures of Non-Silicon Devices
Advisor: Prof. Michael Pecht
Sanjay Tiku (Microsoft Inc., WA)
Ph.D. Mechanical Engineering
Reliability Capability Evaluation for Electronics Manufacturers
Advisor: Prof. Michael Pecht
Ping Zhao (Apple)
Ph.D. Mechanical Engineering
Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes
Advisor: Prof. Michael Pecht
Yunqi Zheng (General Motors Technical Center, MI)
Ph.D. Mechanical Engineering
Effect of Surface Finishes and
imtermetallics on power Cycling Reliability of Snagcu Die Attach
Advisor: Prof. Patrick McCluskey
M.S.
Rajeev Mishra (Apple, CA)
M.S. Mechanical Engineering
An Uprateability Risk Assessment Methodology
Advisor: Prof. Michael Pecht
2004
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Ph.D.
Nathan J. Blattau (Entrepeneur)
Ph.D. Mechanical Engineering
Models For Rapid Assessment of Surface Mount Component FailuresDuring Printed Wiring Board Bending
Advisor: Prof. Donald Barker
Sungyeol Cho (Intel)
Ph.D. Mechanical Engineering
Development of Optical Measurement Technique for Nano-Mechanics
Daniel Donahoe (1000 kilometers, UT)
Ph.D. Mechanical Engineering
Moisture in Multilayer Ceramic Capacitors
Advisor: Prof. Michael Pecht
Lin Li
Ph.D. Mechanical Engineering
Analysis and Mitigation of Electromagnetic Noise in Resonant Cavities and Apertures
Karumbu Nathan Meyyappan (Intel Corp., OR)
Ph.D. Mechanical Engineering
Failure Prediction of Wire Bonds due to Flexure
Advisor: Prof. Patrick McCluskey
Keith Rogers (U.S. Department of Defense, MD)
Ph.D. Mechanical Engineering
An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites
Advisor: Prof. Michael Pecht
Pameet Singh (GE)
Ph.D. Mechanical Engineering
Forecasting Technology Insertion
Concurrent with Design Refresh Planning for COTS-Based Obsolescence
Sensitive Sustainment-Dominated Systems
Advisor: Prof. Peter Sandborn
M.S. Mechanical Engineering - 2001
Design Refresh Planning Optimization
Driven by Electronic Part Obsolescence
Qian Zhang (Carefusion, CA)
Ph.D. Mechanical Engineering
Isothermal Mechanical and Thermo-Mechancial Durability Characterizaton of Selected Pb-free Solders
Advisor: Prof. Abhijit Dasgupta
M.S.
Arvind Chandrasekaran (MBA student, UCLA)
M.S. Mechanical Engineering
Effect of mold compound on Au-Al wirebond-bondpad intermetallic formation
Advisor: Prof. Patrick McCluskey
Sathyanarayan Ganesan (Intel, AZ)
M.S. Mechanical Engineering
Virtual Design and Improved System Level Approach for Life Consumption Monitoring of Electronics
Advisor: Prof. Michael Pecht
Sony Mathew (CALCE-UMD, MD)
M.S. Mechanical Engineering
Remaining life assessment Methodology for electronic hardware under vibration and shock Loads
Advisor: Prof. Michael Pecht
Zhen Shi
M.S. Mechanical Engineering
Test of Electronic Systems Assembly
Anshul Shrivastava (CALCE-UMD, MD)
M.S. Mechanical Engineering
2003
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Ph.D.
Leon Lantz (LPS, MD)
Ph.D. Mechanical Engineering
The Measurement of Ion Diffusion in Epoxy Molding Compounds Used to Encapsulate Microelectronic Devices
Thomas Stadterman (U.S. AMSAA, MD)
Ph.D. Mechanical Engineering
Practical Assessment Methodologies for Circuit Cards Under Mechanical Shock Loading
Ricky Valentin (University of Puerto Rico, Mayaguz, Puerto Rico)
Ph.D. Mechanical Engineering
A Rapid Failure Assessment Approach for Insertion Mounted Solder Interconnects Under Thermomechanical Cycling
Zhaoyang Wang (The Catholic University of America, DC)
Ph.D. Mechanical Engineering
Development and Application of Computer-aided Fringe Analysis
Advisor: Dr. Bongtae Han
Ji Wu (Intel, AZ)
Ph.D. Mechanical Engineering
Electrical Characterizaton and Reliability Assessment of Lead-Free Solder Separable Contact Interfaces
Xin Wu
Ph.D. Mechanical Engineering
Developing Highly Accurate and Stable Open-region Electromagnetic Simulations
Advisor: Prof. Omar M. Ramahi
Yubing Yang
Ph.D. Mechanical Engineering
Reliability Assessment of Optical Fibers Under Tension and Bending Loads
Advisor: Prof. Donald Barker
M.S.
Elissa Bumiller (NSWC, MD)
M.S. Mechanical Engineering
Electrochemical Migration on FR-4 Printed Wiring Board Surface
Derya Calhan
M.S. Mechanical Engineering
An Application of the 3-Parameter Weibull Distribution to the Estimation of the Failure Free Operating Period of Electronic Systems
Paul Casey (Electrolux Home Products Corporation N.V., Belgium)
M.S. Mechanical Engineering
Managementof Lead-Free Solder Alloy Intellectual Property for Lead-Free Electronics
Shirish Gupta (Dell, TX)
M.S. Mechanical Engineering
Temperature and Rate Dependent Partitioned Constitutive Relationships for 95.5PB2SN2.5AG Solder Alloy
Advisor: Prof. Patrick McCluskey
Satchidananda Mishra (Dell Computer Crop., TX)
M.S. Mechanical Engineering
Life Consumption Monitoring for Electronics
Advisor: Prof. Michael Pecht
Deborah Pollack (NIST)
M.S. Mechanical Engineering
Validity of Constitutive Properties of Mechanical Deformation Analysis of Eutectic Solder
Subramanian Rajagopal (Capital One, VA)
M.S. Mechanical Engineering
Transition of Low-Volume Complex Electronics System Industries to Lead-free Electronics
Anoop Rawat (Chrysler, MD)
M.S. Mechanical Engineering
Thermomechanical Characterization and Evaluation of Conformal Coatings
Vidyasagar Shetty
M.S. Mechanical Engineering
Remaining Life Assessme
nt Process of Electronic Systems
Advisors: Prof. Michael Pecht, Prof. Patrick McCluskey and Prof. Peter Sandborn
Eric Stellrecht (Sierra Research)
M.S. Mechanical Engineering
Hygroscopic Swelling in Plastic Encapsulated Microelectronics: An Experimental Study Using Moiré Interferometry
Niranjan Vijayaragavan
(Boston Consulting Group, Houston)
M.S. Mechanical Engineering
Physics of Failure Based Reliability Assessment of Printed Circuit Boards Used Permanent Downhole Monitoring Sensor Gauges
2002
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Ph.D.
Casey O'Connor (Sensors for Medicine and Science, Inc. MD)
Ph.D. Mechanical Engineering
Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits
Advisors: Prof. Patrick McCluskey
M.S.
Daniel V. Becker (Northrop, MD)
M.S. Mechanical Engineering
Development and Application of
Yielded Cost in Electronic Manufacturing Process Improvement
Harish Bhaskaran (Yale University)
M.S. Mechanical Engineering
Die Shear Experimental and Modeling Verification of Chip-to-Chip Bonded Microelectromechanical Systems
Vijaya B. Chebolu (Professor, Texas A&M University, TX)
M.S. Mechanical Engineering
Frequency-Domain Simulation of Open-Region Radiation and Scattering Problems Using the Complementary Operators Method
Advisors: Dr. Omar M. Ramahi
Jeremy Cunningham (Honeywell, AZ)
M.S. Mechanical Engineering
Demonstration of Physics-of-Failure Assessment of an Avionic Controller
Brent M. Mager (Systems Engineering Group, MD)
M.S. Mechanical Engineering
Analytic Characterization of
Interconnect Shear Force Behavior
Vinay Subramanian
(Goldman Sachs)
M.S. Mechanical Engineering
Modeling and Predictions of Switching Noise in High Speed Circuts and Packages
Advisors: Dr. Omar M. Ramahi
Zeke Topolosky
M.S. Mechanical Engineering
Reliability Analysis of Springs Used as Interconnects in Press-Pack Power Electronic Modules
2001
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Ph.D.
Haleh Ardebili (University of Houston, TX )
Ph.D. Mechanical Engineering
Moisture Diffusion and Reliability
Issues Associated with Moisture in Plastic Encapsulated
Microelectronics
Keita Broadwater (HP, OR)
Ph.D. Mechanical Engineering
Characterization and Health Monitoring of Epoxy-Cured Fiber Optic Connectors Via Fiber Optic Sensing
Richard Ciocci (Pennsylvania State University, PA)
Ph.D. Mechanical Engineering
Assessing the Migration to Lead-free
Electronic Products
Peter L. Haswell (Hamilton Sunstrand, CT)
Ph.D. Mechanical Engineering
Durability Assessment and Microstructural Observations of Selected Solder Alloys
Advisor: Prof. Kenneth T. Kiger
Weifeng Liu, (Huawei)
Ph.D. Mechanical Engineering
Reliability Assessment of IC Component
Sockets
Advisor: Prof. Michael Pecht
Nicoletta Sangalli
(Cascade Engineering, WA)
Ph.D. Mechanical Engineering
Development of Creep-Fatigue Crack
Propagation Models for Solder Joint
M.S.
Samuel Bardhan
(Zygo Corporation, CT)
M.S. Mechanical Engineering
Electronics Technology Insertion
into Low Volume Complex Electronic Systems (LVCES)
Advisor: Prof. Michael Pecht
Pavan Davuluri (Microsoft, WA)
M.S. Mechanical Engineering
A multi- scale
modeling approach for stress analysis of electronic interconnects
Advisor: Prof. Abhijit Dasgupta
Deepak Gopinath (GE, MI)
M.S. Mechanical Engineering
Multi-Objective Placement
Optimization of Power Electronic Modules on Liquid Cooled Heat Sinks
Kunal Goray (GE, Germany)
M.S. Mechanical Engineering
Durability of Surface mount components under flexural loads
Shantanu Kalchuri (Qualcomm, CA)
M.S. Mechanical Engineering
Effects of Low Temperature Power
Cycling on Reliability of Power Electronic Devices
Advisor: Prof. Patrick McCluskey
Majed Majeed
M.S. Mechanical Engineering
Multifunctional Dual-Stiffness
Sensor for Insitu Real-time Stiffness and Energy-Density
Steve Murray (Northrop Grumman, MD)
M.S. Mechanical Engineering
Aging and Qualification of Polyimide
Dielectric Film
Jagadeesh Radhakrishnan (Intel, CA)
M.S. Mechanical Engineering
A Process-Based Cost of
Ownership Model for Inclusion of High-Frequency Micromachined Structures
in a Conventional
Advisor: Prof. Peter Sandborm
Ravi Raghavan (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Analysis of Test/Diagnosis/Rework
Operation Placement in the Technical Cost Modeling of Advanced Electrical
Power System Modules
Advisor: Prof. Peter Sandborm
Arun Ramakrishnan (Broadcom)
M.S. Mechanical Engineering
Healthand Life Consumption
Monitoring Using Sensor Technologies
Advisor: Prof. Michael Pecht
Daniel Ragan (Price WaterHouse Cooper, VA)
M.S. Mechanical Engineering
Detail Cost Modeling for use with
Hardware/Software Co-Design of a System on a Chip
Shubhada Sahasrabudhe (Intel, AZ)
M.S. Mechanical Engineering
Implementation and
interpretation of Failure Free Operating Periods and Associated
Confidence Limits in Electronic Systems Using 3-Parameter Weibull
Distribution
Kontay V. Sexton (U.S. Department of Defense, MD)
M.S. Mechanical Engineering
Formulation of Simple Model to
Assess Microvia Thermal Cycle Fatigue Life
Advisor: Prof. Donald Barker
Jaspreet Sidhu
M.S. Mechanical Engineering
Reliability Assessment of Thinpak
Power Module for Thermal Cycling Environments
Advisor: Prof. Patrick McCluskey
Rajesh Swaminathan (Manager, Office of the CTO at Applied Materials)
M.S. Mechanical Engineering
Experimental and Theoretical
Methods for Estimating the Delamination of MEMS Chip-to-Chip Bonded
Devices in a LIGA-Based Safety and Arming System
Tobias Syrus (Schlumberger, Texas)
M.S. Mechanical Engineering
Refinement of Part and Manufacturer
Assessment and Update to Include Discrete Passive Parts
Advisor: Prof. Michael Pecht
Dong-won Yoo (LGA, S. Korea)
M.S. Mechanical Engineering
Smart Thermal Management Systems Based
on Solid Liquid Phase Change Materials (PCM)
Advisor: Prof. Yogendra K. Joshi
Lang Yuan (Fujitsu Network Communications, NY)
M.S. Mechanical Engineering
The Effect of Orientation and Imposed
Circulation on the Performance of A Compact Two-Phase Thermosyphon
2000
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Ph.D.
Juscelino Hozumi Okura (Apple)
Ph.D. Mechanical Engineering
Assessment of Reliability of Low-cost
Flip Chip Assembiles
C. Scott Sealing (General Electric, Corp.)
Ph.D. Mechanical Engineering
Accelerated Testing and Health Monitoring Methods for Electronic
Circuit Cards and Electronic Box Assemblies
Advisor: Prof. Abhijith Dasgupta
Pradeep Sharma (University of Houston, TX)
Ph.D. Mechanical Engineering
Micro-Structural Modeling of Cyclic
Creep Damage in Tin-lead Eutectic Solder
P. S. R. Shekhar (IBM Corp.)
Ph.D. Mechanical Engineering
Enhancement of Test-Time Compression for Thermal Cycling Based
Accelerated Testing of Surface Mount electronics
Jingsong Xie (Beihang University, China)
Ph.D. Mechanical Engineering
Characterization of Conductive
Elastomer Button Style Integrated Circuit Component Sockets
Advisor: Prof. Michael Pecht
M.S.
James Cho (Quantum Photonics, MD)
M.S. Mechanical Engineering
Accelerated Thermomechancial Qualification of an Automotive Electronic Module
Advisor: Prof. Abhijith Dasgupta
Andrew Green (NSWC, VA)
M.S. Mechanical Engineering
Development of Edge-Card Connector Vibration Testing Device
Zhenya Huang (Lenovo Lean Six Sigma)
M.S. Mechanical Engineering
Parts Selection and Management - ASICs: A Life Cycle Perspective to Supply
Chain Management and Technology Trend Analyses
Advisor: Prof. Michael Pecht
Raghuram Iyengar (Ph.D. Student at Columbia University, NY)
M.S. Mechanical Engineering
Investigation into New Attach Materials for Power Devices
Raj Narayan
M.S. Mechanical Engineering
Management and Decision Support for the Contract Manufacturing of Electronic Products
Rajesh Natarajan (Comcast, MD)
M.S. Mechanical Engineering
Screening of Electronic Assemblies
Srinivasan Parthasarathy (Advanced Micro Devices, CA)
M.S. Mechanical Engineering
Reliability of Die Attach Materials
Neeraj Pendse
(Elo TouchSystems, Menlo Park, CA. )
M.S. Mechanical Engineering
Stress Balancing: A Method of
uprating and Uprating Case Studies
Advisor: Prof. Michael Pecht
Bharatwaj Ramakrishnan (AMD, CA)
M.S. Mechanical Engineering
Interval Estimation and Qualification for Failure Free Operating Periods in Electronic Systems
Advisor: Prof. Michael Pecht
Rajdeep Sharma (General Electric, Corp.)
M.S. Mechanical Engineering
A Probabilistic Methodology for Virtual QUalification
Advisor: Prof. Patrick McCluskey
Santosh Shetty (BP America, TX)
M.S. Mechanical Engineering
Effect of Cyclic Bending on Chip Scale Package Assemblies
Gowrishankar Subramanian (AMD, CA)
M.S. Mechanical Engineering
Analysis Methods for Size/Cost Tradeoffs for PWBs with Embedded Passives
Rajiv Subrahmanyam (Netapps, AZ)
M.S. Mechanical Engineering
The Economic Impact of Component
Replacement in Electronic Systems
Thiagarajan Trichy (Oracle CA)
M.S. Mechanical Engineering
Full Monte Carlo Technical Cost
Modeling with Detailed Test/Rework Analysis for Inclusion in a
Multi-Attribute Optimization Environment
Advisor: Prof. Peter A. Sandborn
Kang Zhang (Dell)
M.S. Mechanical Engineering
Reliability Assessment and Failure Analysis of Plastic Ball Grid Array
1999
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Ph.D.
Krishna Darbha (Microsoft, WA)
Ph.D. Mechanical Engineering
A Physics of Failure
(PoF) Approach for Virtual Qualification of Area Array Interconnect
Technologies
Advisor: Prof. Abhijith Dasgupta
Diganta Das (CALCE EPSC, MD)
Ph.D. Mechanical Engineering
Effect of thermal profile on performance and reliability of microelectronics
Advisor: Prof. Michael Pecht
Prateek J. Dujari (Intel, OR)
Ph.D. Mechanical Engineering
Analysis of Random Vibration on
Repetitive Shock and Electrodynamic Shakers for Accelerated Fatigue of
Electronic Interconnects
Chandrashekhar Ramaswamy (IBM)
Ph.D. Mechanical Engineering
Compact thermosyphons for passive
thermal control of high heat flux electronic components
Rajeev Solomon (Raytheon, AZ)
Ph.D. Mechanical Engineering
Life Cycle Mismatch Assessment and
Obsolescence Management of Electronic Components
Advisor: Prof. Michael Pecht
Ming Sun (Broadcom, CA)
Ph.D. Mechanical Engineering
Lifetime Resistance Models of Electrical
Contact and Interconnect
Advisor: Prof. Michael Pecht
M.S.
Dhiraj Bansal (Spansion, CA)
M.S. Mechanical Engineering
Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips
Michael Dean Blattau (Applied Data Systems, Inc., MD)
M.S. Mechanical Engineering
Evaluation of Ist Test Technology for Plated Through Hole Reliability
Mark Henry
M.S. Mechanical Engineering
A Methodology for Determining Root Causes of Failures due to Contamination of Electronic Assemblies
Advisor: Prof. Michael Pecht
Kofi Mensah (Intel Corp., AZ)
M.S. Mechanical Engineering
Relative Reliability of Plastic and Ceramic Microelectronic
Components at Elevated Temparature
Advisor: Prof. Patrick McCluskey
Aravind Ramamoorthy (Intel Corp.)
M.S. Mechanical Engineering
Investigation of Variable Frequency Microwave technology for rapid
curing of flip chip underfills
Ramgopal Venkata Uppalapati (Intel, OR)
M.S. Mechanical Engineering
A Case Study Assessment of
Electronic Part Manufacturers and Part Families
Advisor: Prof. Michael Pecht
Daniel Sagrario
M.S. Mechanical Engineering
Optoelectronic Packaging and Reliability
Dawn A. Thomas (Metasensors Inc., MD)
M.S. Mechanical Engineering
Analysis of Cannot Duplicate Failures
Cheng-Chieh Tu (Taiwan)
M.S. Mechanical Engineering
Effect of Exposure and Wettability of Solder on Various Board Finishes
1998
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Ph.D.
Vance H. Adams (Motorola)
Ph.D. Mechanical Engineering
Three-Dimensional
Study of Combined Conduction, Radiation, and Natural Convection from an
Array of Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure
Kristen Marie Hines (Clark School of Engineering, UMD)
Ph.D. Mechanical Engineering
The Effect of Metal Vias on the Strength of Ceramic Printed Wiring
Board
Lan Tang(Cisco Systems, MA)
Ph.D. Mechanical Engineering
A Multi-Scale, Conjugate Thermal
Analysis Methodology for Convectively Cooled Electronic Enclosures
Kumar Upadhyayula (Cascade Engineering, CA)
Ph.D. Mechanical Engineering
An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments
M.S.
Ritesh Jain (Intel Corp., OR)
M.S. Mechanical Engineering
Evaluation of Wire Bond Systems in High Temperature Electronics
Advisor: Prof. Patrick McCluskey
Young-Do Kweon (Flip Chip Technologies Inc., AZ)
M.S. Mechanical Engineering
Experimental degradation analysis and remaining life assessment for
electronic assemblies
Advisor: Prof. Patrick McCluskey
Anant Mathur
(Apple, Cupertino CA)
M.S. Mechanical Engineering
Manufacturer, Electronic Part Quality and Integrity, and Distributor Assessment
Manpreet Nagvanshi(General Motors, MI)
M.S. Mechanical Engineering
Electrical and Mechanical Characterization of Particle Filled Extrinsic Polymer Composites
Advisor: Prof. Patrick McCluskey
Naveen Palli (i2, Dallas, TX)
M.S. Mechanical Engineering
An Interactive Multistage Method for Multiple Objectives Decision Making
Advisor: Prof. S. Azarm
Nivedan Tiwari
M.S. Mechanical Engineering
Computer Aided Design of Microelectronic Packages
Yibin Zhang (CommerceOne Inc.)
M.S. Mechanical Engineering
Case Studies of Semiconductor Component Reliability
Advisor: Prof. Michael Pecht
1997
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Ph.D.
Michael Cushing
Ph.D. Reliability Engineering
Monte
Carlo Reliability Simulations Of An Electrical-Overstress Model Using Symbolic
Math Tools
Sharon X. Ling (Applied Physics Laboratory, Johns
Hopkins University, MD)
Ph.D. Mechanical Engineering
A Multi-domain Rayleigh Ritz
Thermomechanical Stress Analysis Model for Surface-mount Interconnects
Advisor: Prof. Abhijith Dasgupta
M.S.
John Neel
M.S. Mechanical Engineering
Semi-analytic Durability Models for
Surface Mount Solder Joints
Damion Searls (Intel Corp., OR)
M.S. Mechanical Engineering
Uprating of Components for Use
Outside Their Temperature Specifications
Hala To'mey (Applied Physics Labs, Johns
Hopkins University, MD)
M.S. Mechanical Engineering
Qualification of IBM Laptop for
Ruggedized Environment
Kellie A. Turner (ELDEC Corporation, WA)
M.S. Mechanical Engineering
Uprating the IBM 730TE Thinkpad
Computer for use in a Public Safety Mobile Computing Environment
Donald James Walker
M.S. Mechanical Engineering
Circuit Card Assembly Failure
Mechanism Model Handbook
1996
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Ph.D.
Kevin Cluff (Abbot Lab, TX)
Ph.D. Mechanical Engineering
Characterizing
the Humidity and Thermal Environments of Commercial Avionics for Accelerated
Test Tailoring
Rod Martens (FormFactor, Inc., CA)
Ph.D. Mechanical Engineering
Automated Contact Resistance
Probe
Debabrata Pal (Hamilton Sundstrand, IL)
Ph.D. Mechanical Engineering
Application of Phase Change Materials to
Passive Thermal Control of Electronic Modules
Enchao Yu (CFD Research Corp., AL)
Ph.D. Mechanical Engineering
Passive Cooling of Vented and Closed
Enclosures by Natural Convection, Conduction and Radiation
M.S.
Andre Fowler (Intel, AZ)
M.S. Mechanical Engineering
Storage Reliability Assessment
Modeling of PEMs
Anand Govind (LSI Logic, CA)
M.S. Mechanical Engineering
Real-Time
Measurement and Characterization of Deformations in Surface Mount Packages
during Infra-Red Reflow Soldering
Margaret Jackson (Emergency Response Services, MD)
M.S. Mechanical Engineering
Developing a Part Selection Plan
using Benchmarking and Other Techniques
Jill Jordan (Northrup Grumman Corp., MD)
M.S. Mechanical Engineering
Effectiveness of Screening
Procedures
Nikhil V. Kelkar (National Semiconductor Corp.,
CA)
M.S. Mechanical Engineering
Phenomenological
Reliability Modeling of Plastic Encapsulated Microcircuits
Kevin Lyons (NIST, MD)
M.S. Mechanical Engineering
Product Realization Process
Modeling: A Study of Requirements and Needs for Successful
Implementation
Anindya Poddar (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Development of a Ruggedized Laptop
Computer for Mobile Applications
Advisor: Prof. Donald Barker
Yogendra Ranade (LSI Logic Corp., CA)
M.S. Mechanical Engineering
Delamination and Cracking Effects in
PEMs
Timothy Rothman (Intel, CA)
M.S. Mechanical Engineering
Acceleration Transform Model for
Leadless Solder Joint
Anand Shukla (Flarion Technologies, NJ)
M.S. Mechanical Engineering
Sorption Characterization of
Laminates Used in Electronic Packaging Substrates
Vani Verma (Cypress Corp., CA)
M.S. Mechanical Engineering
Mechanical and Thermal Analysis of a
Unit Cell of a Microbridge Uncooled Focal Plane Array Infrared
Detector
1995
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Ph.D.
An-Tung Chen (National Semiconductor, CA)
Ph.D. Mechanical Engineering
Plated
Through Hole Life Estimation in Rigid Flex Using Finite Element Analysis
Advisor: Prof. Donald Barker
Jillian Evans
Ph.D. Reliability Engineering
Effects
of Thermal and Humidity Cycling on 3-D Electronic Packaging Technology
M.S. Mechanical Engineering - 1993
Qualification
and Quality Assurance of 3-D Technology
Prasad Yalamanchili (Analog Devices, Inc., CA)
Ph.D. Mechanical Engineering
Evaluation of Electronic
Packaging Reliability Using Acoustic Microscopy
M.S.
Richard A. Bauernschub (AAI Systems, MD)
M.S. Mechanical Engineering
A
Physics-of-failure Approach to Defect-related Reliability
Qing Yan Jenny Chen (AT&T, NJ)
M.S. Mechanical Engineering
Failure
Mechanisms and Reliability Assessment of Optoelectronic and Electronic
Packages
Gautam Ganguly (Juniper Systems, CA)
M.S. Mechanical Engineering
Damage
Due To Lead Insertion in Through-Hole Compliant Pin Connectors
Ranjit Gannamani (Microsoft, CA)
M.S. Mechanical Engineering
Assembly
of PEMs Without Popcorning
Ramesh Munamarty (Oracle Consulting, GA)
M.S. Mechanical Engineering
Failure Mechanisms of Plastic
Encapsulated Microcircuits
Tanmay Panchwagh (Aerospace Engineering & Research
Associates)
M.S. Mechanical Engineering
Reliability of Surface Mount
Capacitor Subjected to Wave Soldering
Loren Louis Roy (Silicon Video Corp., CA)
M.S. Mechanical Engineering
Experimental Determination of the Shear
Modulus of Compliant Adhesives Using Single Lap-Shear Tests
Advisor: Prof. Donald Barker
S. Sidharth (Microsoft Corp., WA)
Ph.D. Mechanical Engineering
Fatigue Life Estimation of Leads in
Local Electronic Assemblies Subject to Vibration
G. B. Vasanth (Texas Instruments, TX)
M.S. Mechanical Engineering
Physics of Failure of Power MOSFETs
1994
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Ph.D.
Vineet K. Gupta (Delco Electronics, IN)
Ph.D. Mechanical Engineering (Solid Mechanics)
Modeling
Solder Joint Reliability For Surface Mount Compliant Leaded Electronic
Components
Advisor: Prof. Donald Barker
Choupin Huang (Analog Devices, Inc., CA)
Ph.D. Materials and Nuclear Engineering
Degradation
Analysis and Modeling of Bi-Sb-Te(Se) Semiconductor Thermoelectric Power
Modules
Sundaram Sridhar (Philips Electronics - North America
Corporation, NJ)
Ph.D. Mechanical Engineering
Heat Transfer and Pressure Drop in
Flows Perpendicular to an Offset Fin Structure
M.S.
Balu Rudra (Entrepreneur, Tympana Lmt)
M.S. Mechanical Engineering
Conductive
Filament Formation in Printed Wiring Boards
Vikram Chandra (Becton Dickinson, MD)
M.S. Mechanical Engineering
Computer
Tools for Reliability Modelling and Assessment of Microelectronic Packages
Advisor: Prof. Michael Pecht
Anupam Malhotra (Automotive Multimedia Interface
Collaboration, MI)
M.S. Mechanical Engineering
Standard
Program for Reliable Product Development
Ashok S. Prabhu (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Stress Analysis of the G.E. High
Density Interconnect
Seshadri Vikram (National Semiconductor, CA)
M.S. Mechanical Engineering
Correlation
of Natural Convection Heat Transfer from a Horizontal Printed Circuit Board
in an Enclosure
1993
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Ph.D.
Ten-ken Hwang (Dynamic Systems, CA)
Ph.D. Materials and Nuclear Engineering
Monte Carlo Reliability Model for
Monolithic Microwave Integrated circuits (MMICs)
Pradeep Lall (Auburn University, AL)
Ph.D. Mechanical Engineering
The Influence of Temperature on
Microelectronic Device Failures
Xin Wu (Corona Optical Systems, IL)
Ph.D. Mechanical Engineering
An Experimental Study of Polyimide Films
Used in High Density Interconnects
Advisor: Prof. Michael Pecht
M.S.
Christopher W. Argento (Motorola, TX)
M.S. Mechanical Engineering
Forced Convection Air Cooling of a Commercial Electronic Chassis:
Experiments and Computations
Shrikar Bhagath (SanDisk, CA)
M.S. Mechanical Engineering
Mechano-Stochastic
Modeling of Connector Reliability
Advisor: Prof. Michael Pecht
Kamran Gohari (Thomas & Betts)
M.S. Mechanical Engineering
Effect of Temperature and Humidity
Cycling on FR-4, BT and CE Printed Wiring Boards
Jong-Shyang Kuo (Lockheed-Martin, CA)
M.S. Mechanical Engineering
Temperature
Dependent Performance Simulation and Failure Mechanisms of Heterostructure
Field Effect Transistors and Inverter Circuits
Barry Mathieu (Raytheon Co., MD)
M.S. Mechanical Engineering
Stress Analysis of Glass Lead Seals
Under General Mechanical Loading
Vijay Ramappan (Ford Motor Corp., MI)
M.S. Mechanical Engineering
A Numerical Simulation of Selected
Manufacturing Variabilities in Plated Through Holes
Advisor: Prof. Abhijit Dasgupta
1992
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Ph.D.
Rakesh K. Agarwal (BP America Inc.)
Ph.D. Mechanical Engineering
Prediction
of Thermal, Dielectric and Thermo-Mechanical Properties of Woven-Fabric
Composites for PWB Substrate Materials
Advisor: Prof. Michael Pecht and Prof. Abhijit Dasgupta
Sarvotham M. Bhandarkar(Navin) (National Semiconductor:
Packaging & Process Development Division, Singapore)
Ph.D. Mechanical Engineering
Thermomechanical
Analysis and Fatigue Life Prediction of Multilayer PWB PTHs
Yeong-Shu Chen (NJIT, NJ)
Ph.D. Mechanical Engineering
Predicting
the Vibration Fatigue Lives of Electronic Components Mounted on a Printed
Wiring Board
Chandrasekhar Pusarla (MACOM, MA)
Ph.D. Mechanical Engineering
Design Guidelines for Flip-Chip
Bonding for Hermetic Microelectronic Packages
M.S.
Ajay K. Arora (Visteon Automotive Systems, MI)
M.S. Mechanical Engineering
Design
Guidelines for Lid Seals and Lids of Hermetic Microelectronic Packages
Sudha Balakrishnan (Western Electronics, CA)
M.S. Mechanical Engineering
A
Concurrent Approach to Printed Wiring Board Assembly Design
Gary Bonadies (Westinghouse, MD)
M.S. Mechanical Engineering - 1992
A
Computer Integrated Product Development Environment: An Implementation
of Concurrent Engineering for the Conceptual Design of Electronic Systems
Advisor: Prof. Michael Pecht
David Harris (Pulse Embedded Computer System, MD)
M.S. Mechanical Engineering
Fuzz
Button Design Variation and Performance Effects
Advisor: Prof. Michael Pecht
Scott David Johnson (Westinghouse, MD)
M.S. Mechanical Engineering
Experimental Determination of
Mechanical Properties of Single Crystal Gallium Arsenide (GaAs) Wafers
Advisor: Prof. Donald Barker
Douglas Lawton (Westinghouse, MD)
M.S. Mechanical Engineering
Interface Heat Transfer and Wedgelock
Assemblies
Nabil Mofid (Piemont, NC)
M.S. Mechanical Engineering
Transient Thermal Stress Analysis of
Surface Mounted MLC Capacitors Subjected to Wave Soldering
Shailendra Verma (Delco Electronics, IN)
M.S. Mechanical Engineering
Screening Guidelines for Electronics
at the Assembly Level
Zhan Zhang (U.S. Government - DC)
M.S. Mechanical Engineering
Project Planning and Scheduling in a
Concurrent Engineering Environment
Lily Hui Zhu (NIST, MD)
M.S. Electrical Engineering
High Temperature Modeling and Thermal
Characteristics of GaAs Mesfets on Diamond Heat Sinks
1991
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1990
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M.S.
Paul Eric Biegel
M.S. Mechanical Engineering
A
Framework for Decision Support in Concurrent Product Development
Advisor: Prof. Michael Pecht
Gregory C. Braunberg (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Computer
Aided Infrared Thermography Using Emissivity Compensated Imaging
Advisor: Prof. James W. Dally
Wing Fu Ko (Hong Kong)
M.S. Mechanical Engineering
A Systems Engineering Approach to Design
a Smart Tool Post Structure
Syed Ali Naved Naqvi
M.S. Mechanical Engineering
Transient
Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering
Michael Osterman (CALCE EPSC)
Ph.D. Mechanical Engineering
Placement Methods for Electronic
Components on Printed Wiring Boards Based on Reliability and Routability
Measures
M.S. Mechanical Engineering - 1987
Component Placement for Reliability
and Routability
Advisor: Prof. Michael Pecht
Hugh Steven Reinhart
M.S. Mechanical Engineering
Automated Maintanability
(M) Modeling and Analysis
Advisor: Prof. Michael Pecht
Scott A. Roza
M.S. Mechanical Engineering
Vibrational Modeling of Wedge-lock Edge
Guides
Irfan Sharif
M.S. Mechanical Engineering
Effect of Dimensional Variabilities
on Lead Compliance and Solder Joint Fatigue Life
Jieyu She
M.S. Mechanical Engineering
A New Algorithm for Evaluating Complex
System Reliability
John Vodzak
M.S. Mechanical Engineering
Coupled Thermal and Vibrational
Fatigue Analysis of Solder Joints for Surface Mounted Components
Advisor: Prof. Michael Pecht
Jonathon David Watts
M.S. Mechanical Engineering
Placement for Producibility and
Assembly
Advisor: Prof. Michael Pecht
1989
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M.S.
Amir Afzali (Amkor)
M.S. Mechanical Engineering
Contamination
Induced Failures in Microelectronic Packages
Harry Joseph Hoffman
M.S. Mechanical Engineering
Application
of the Hopkinson Split Bar to Gun Propellant Testing
Sohail Ahmad Khan
M.S. Mechanical Engineering
A Constitutive Stress-Strain Model for
Linerboard Under Various Constant Moisture and Temperature States
Prathviraj Rao
M.S. Mechanical Engineering
Application of Infrared Thermography for
Quantitative Detection of Surface Flaws
Ahmer Syed (Amkor)
M.S. Mechanical Engineering
Vibration Analysis of Printed Wiring
Boards
Pradeep Lall (Auburn University)
M.S. Mechanical Engineering
Wire and wire bond failures in microelectronic packages
1988
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M.S.
Cheryl Lynn Resch (John Hopkins University,
Applied Physics Labs, MD)
M.S. Mechanical Engineering
Calculation and Measurement of Temperature
Profiles of Electronic Printed Wiring Boards
Advisor: Prof. Michael Pecht
Yeun Tsun Wong (Logicon, VA)
M.S. Mechanical Engineering
Steiner Tree Oriented Placement
1987
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M.S.
Timothy Mason Johnson
M.S. Mechanical Engineering
High
Strain Rate Testing of Cement Paste with a Split Hopkinson Pressure Bar
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