| C16-01 |
Comparison of Sequential vs Simultaneous Temperature Cycling and Harmonic Vibration Fatigue: LCR SAC305 Solder Fatigue
|
| C16-02 |
Multiaxial Vibration Fatigue of PWAs: Interactions between PWB Nonlinear Response and Component Nonlinear Response
|
| C16-03 |
Predictive Models for SAC Solder Properties
|
| C16-05 |
Field Failure Rate Prediction of Solder Joint Fatigue Using Statistical Model Calibration and Validation
|
| C16-07 |
Analytical Solder Interconnect Fatigue Life Models for Bonded Surface Mount Part
|
| C16-08 |
Aging of Conformal Coating on Printed Wiring Boards
|
| C16-09 |
Developing an Analytical Approach to Evaluate Copper Trace Fatigue Life in Electronic Assemblies
|
| C16-14 |
Warpage Prediction of Advanced Package Substrate
|
| C16-15 |
PoF Approach for Ranking the Behavior of Different Pressure Sensitive Adhesives PSAs
|
| C16-16 |
Cyclic Fatigue of Selected High-Temperature Solders
|
| C16-17 |
TLPS Joining Materials for Thermally Integrated Power Modules
|
| C16-19 |
Life Estimation for Tantalum Capacitors with Conductive Polymer Electrolytes
|
| C16-21 |
Graphene Interconnects for High VoltagePower Devices and Components
|
| C16-23 |
Effectiveness of HALT and ESS Tests for Electronic Systems
|
| C16-24 |
Reliability Assessment of Advanced Microstructures in Chip-scale Packages
|
| C16-25 |
Physics of Failure Based Approach for Component Use at High Temperature
|
| C16-26 |
Effects of Long Term Storage on Electronic Components
|
| C16-29 |
FEA Model Integration with calceSARA
|
| C16-30 |
Factors Impacting Surface Insulation Loss on Printed Wiring Boards
|
| C16-32 |
Material Selection Criteria to Reduce Pad Cratering
|
