Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis, P. Sandborn and C. Murphy, Proceedings of the Electronic Components and Technology Conference (ECTC), pp. 1261-1266, Lake Buena Vista, FL, June 1, 2001.

A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics, P. McCluskey, Proceedings of the Electronic Component and Technology Conference (ECTC), pp. 397-400, Lake Buena Vista, FL, May 30, 2001.

Student Focus Group Results on Student Project Team Performance Issues, Natishan, M. E., Schmidt, L., Mead, P.F., ASEE Journal of Engineering Education, vol. 89, no. 3, July 2000, p. 269.

Engineering Project Team Training System (EPTTS) for Effective Engineering Project Team Management,  Mead, P.F., Natishan, M., Schmidt, L, Greenberg, J., Bigio, D., Gupte, A. American Society for Engineering Educators Annual Conference, St.Louis, MO, June 2000.

New Course Development in Products and Systems Cost Analysis, P. Sandborn, D. T. Allen, and C. F. Murphy, Proc. of the Electronic Components and Technology Conference, Las Vegas, NV, May 2000, pp. 1021-1026.

Distance Learning in Thermal Design of Electronic Systems the IEEE/NSF Project, Y. Joshi, A. Bar-Cohen, S. Bhavnani, Electronic Components and Technology Conference, 2000.

Electronic Products and Systems Research and Education for the 21st Century, Y. Joshi and P. Sandborn, Future Circuits International., Vol. 6, p.88-91, 2000.

A Multi-University Web-based Undergraduate Course in Electronics Packaging, J. Morris and P. McCluskey, Proc. of 49th Electronic Components & Technology Conf., San Diego, CA, June 1-4, 1999, pp. 899-903.

A Multidisciplinary Sophomore Course in Electronics Packaging,  J. Morris and P. McCluskey,  Proc. of 48th Electronic Components and Technology Conference, Seattle, WA, May 25-28, 1998. pp. 535-540.

EPS Program, Y. Joshi, M. Pecht, and W. Nakayama. Presented at the Electronic Components and Technology Conference, San Jose, CA, May 1997.

A New Educational Program in Electronic Packaging and System Center (EPS), Y. Joshi, D.B. Barker and M. Ojalvo, Journal of Engineering Education, Vol. 86, pp. 83-187, 1997.

Moire Interferometry as a Tool for Engineering Education, B. Han, Y. Guo and C. K. Lim, Proceedings of the 1995 ASME International, Intersociety Electronic Packaging Conference, ASME, Lahaina, HI, March 1995.