CALCE Journal Papers
- P. Davuluri, S. Shetty, A. Dasgupta, S. Young, "Thermomechanical Durability of High I/O BGA Packages", Transactions of the ASME, Vol. 124, pp. 226-270, September 2002.
- K. Verma, S. Park and B. Han, "On the Design Parameters of Flip-Chip PBGA Package Assembly for Optimum Solder Ball Reliability", IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, 2001.
- K. Verma, S. Park, B. Han, "Mechanical Design Parameters for Enhanced Solder Ball Reliability of Flip-Chip PBGA Package Assembly" Proceedings of IPACK'01, July 8-13, 2001, Kauai, Hawaii, USA.
- K. Zhang and M. Pecht, "Effectiveness of Conformal Coatings on a PBGA Subjected to Unbiased High Humidity/High Temperature Tests". Microelectronics International, Vol. 17, No. 3, pp. 16-20, 2000.
- A. Shukla, M. Pecht, J. Jordan, K. Rogers, and D. Jennings, "Hollow Fibres in PCB, MCM-L and PBGA Laminates May Induce Reliability Degradation".Circuit World , Vol. 23, No. 2, pp. 5-6,
1997.
- P. McCluskey, R. Munamarty, and M. Pecht, "Popcorning in PBGA Packages During IR Reflow Soldering". Microelectronics International, No. 42, January 1997, pp. 20-23.
- S. Ling, and A. Dasgupta, "Thermomechanical Stress Analysis Of BGA Interconnects Using The MDRR Technique".Advances in Electronic Packaging, Vol. 1, pp. 1109, 1997.
- R. Munamarty, P. McCluskey, M. Pecht, and L. Yip, "Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages". Soldering and Surface Mount Technology, No. 22, February
1996.
Conference Papers
- H. Qi, S. Ganesan, M. Osterman, and M. Pecht, "Accelerated Testing and Finite Element Analysis of PBGA Under Multiple Environmental Loadings", 2004 International Conference, IEEE Business of Electronic Product Reliability and Liability, pp. 99-106, April 27-30, 2004.
- H. Qi, M. Osterman, M. Young, K. Lee, and S. Oh, T. Schmidt, "Simulation Model Development for Solder Joint Reliability for High Performance FBGA Assemblies", 2004 IEEE 20th Annual Semiconductor Thermal Measurement and Management, pp. 300-307, March 9-11, 2004.
- R. Guha, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, M. Osterman, H. Qi, J. Kennedy J. Veum, "Plastic Ball-Grid-Arrays (PBGA): Are They Ready for Environmentally Harsh Aerospace Applications?", 02WAC-149, World Aviation Congress & Display (WAC), Phoenix, Arizona, November 5-7, 2002.
- T. Baumann, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, J. Kennedy, J. Veum, H. Qi, M. Osterman,
"Underfilled PBGA Packages and Their Board Level Cycling and Vibration Performance", SMTA International 2002, Donald Stephens Convention Center Rosemont, Illinois, Sept. 24-26, 2002.
- J. Xie and M. Pecht, D. Dedonato, A. Hassanzadeh, "An Investigation
on the Mechanical Behavior of Elastomer Interconnects" The
32nd International Symposium on Microelectronics, Chicago, IL, pp.
58-63, October 1999.
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