High Temperature Electronics
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics and automotive and geophysical electronic systems requiring components and packaging reliable to 200 º C and beyond. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples.
Features:
- Based on research conducted at CALCE Electronic Packaging Research Center at the University of Maryland and supported by its over 40 industrial and governmental members
- Chapter contributions by the leading industry and academic experts in electronic products
- A unified treatment of all major aspects and applications of high temperature electronics
- Suitable as a graduate text and as a valuable design guide and
reference
1996, 322 pp., ISBN: 0-8493-9623-9 (alk. paper)
CRC Press, Inc.
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Boca Raton, FL 33431
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