Created: 5/21/95

Updated: 2/5/98

Semiconductor Packaging
A Multidisciplinary Approach

edited by A. Kraus, R. Hannemann and M. Pecht

John Wiley & Sons, New York, NY, 1994

In this book, academic researchers, graduate students, and practicing mechanical, electrical, and materials engineers will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...

• Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, and selection of package materials.

• Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics.

• Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture the next decade.

ISBN: 0-471-53299-1
John Wiley & Sons Inc.
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New York, NY 10158-0012
ATT: Barb Timmerman
Order Toll Free: 800-879-4539

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