This comprehensive reference
text explains the electronics design process indepth and examines
techniques for microelectronic packaging as well as fundamental
topics in the development of complete electronic systems. The book
presents techniques for design and fabrication of microelectronic
packages and explores the standard materials, manufacturing
processes, interconnection methods, and applications for each level
of electronic assembly. Concepts used to predict and measure the
stresses of electronic systems in service are analyzed, and tools
for designing against thermal, thermomechanical, vibration, shock
and corrosion damage are identified. Techniques for reliability
assessment are described and board layout techniques are also
covered. The book is being used as the text for a graduate course
in mechanical engineering at the University of Maryland titled
"Packaging of Advanced Electronic Systems."
ISBN: 0-8247-7921-5
Marcel Dekker, Inc.
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Handbook of Electronic Package Design