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Non-Destructive Evaluation
Scanning acoustic microscopy (SAM)
Scanning acoustic microscopy (SAM) is a non-destructive technique that
can be used to image the internal features of a specimen. SAM is
highly sensitive to the presence of delaminations, and can detect
delaminations of sub-micron thickness, which are difficult to detect
using X-ray radiography. SAM is an important tool for detecting popcorn
cracking/delamination, die attach voiding, evaluating flip chip
underfill integrity, and lid seal integrity in hermetically sealed
packages. Ceramic direct bond substrates may be inspected for
delamination using SAM. This technique may also be used to
determine the thickness of an internal layer of material. As received part Solder dipped part CALCE uses a SONIX Scanning Acoustic Microscope to conduct acoustic microscopy. A close relationship with SONIX, a member of the CALCE, allows CALCE to stay constantly updated on the latest techniques and technologies available in acoustic microscopy. A wide range of transducer frequencies, from 2.25 to 230 MHz, also provides CALCE the capability to conduct SAM on a number of electronic products and components, regardless of the sample thickness or resolution required. |
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