Materials Characterization

CALCE has an extensive number of equipment dedicated to characterizing the properties of materials used in electronic packaging. The procedures detailed on the left are designed to measure transition temperatures (glass, melting, vaporization), coefficient of thermal expansion (CTE), swelling due to moisture absorption, weight change vs. temperature, fatigue/creep/stress relaxation properties, elastic modulus, hardness, electrical resistance, and composition. All this information can be gained over a wide range of temperatures.

Information on CALCE's capabilities to characterize electrical and thermal properties are detailed elsewhere on this site.

Differential Scanning Calorimetry (DSC)

Thermo-mechanical Analysis (TMA)

Dynamic Mechanical Analysis

Microi-dentation

Contact Resistance Measurements

Energy Dispersive Spectroscopy (EDS)

High Performance Liquid Chromatography (HPLC)

Thermal Diffusivity Measurements