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Failure
Analysis
| Electrical Testing| Non-Destructive
Evaluation| Destructive Evaluationon| Contact Us|
- Destructive Evaluation -
- Focused Ion Beam Imaging -
Using a finely focused ion beam, FIB technology can
perform product failure analysis at a detail much finer
than previously possible. The operator is able to quickly
and selectively remove dielectric or metal layers for
probing and material analysis of underlying surfaces. Rapid
cross-sections of buried circuitry can also be performed
with sub-micron accuracy.
Introduction
Electrical Testing
Non-Destructive Evaluation
Destructive Evaluation
Microsectioning
Decapsulation/Delidding
*Optical Microscopy
*Scanning Electron Microscopy (SEM)
*Energy Dispersive Microscopy (EDS)
Focused Ion Beam (FIB) Imaging
*Scanning Magnetic Microscopy (SMM)
Transmission Electron Microscopy (TEM)
*Fourier Transform Infrared Spectroscopy (FTIR)
*Contact Resistance Measurements
Assessment of Popcorning in PEMs
*These techniques are also performed during
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