Failure Analysis

Interconnects are critical to the proper functioning of electronic components and are a common failure site due to requirements for small size, power and signal conduction, thermal diffusivity, and mechanical support. Microtesting plays an important role in providing information on the quality and integrity of these component interconnects after production, storage, and use. Microtesting includes the measurement of the strength of die adhesives, wires, tabs, ball bonds, wedge bonds, soldered surface mount leads, solder ball/bond pad interfaces, and solder bump/under bump metallurgy (UBM) interfaces (the later two tests are performed on ball grid arrays (BGAs)).

To perform microtesting, CALCE uses the DAGE 2400. The 2400 is a precision universal strength testing system for evaluating micro-electronic structures. Information from tests performed on the 2400 can help ensure manufacturers of high-reliability electronic components of high strength wire bonds and die adhesion in virgin parts and those components which have undergone accelerated testing. The DAGE 2400 performs:

Introduction

Electrical Testing

Non-Destructive Evaluation

Destructive Evaluation

Microsectioning

Decapsulation/Delidding

*These techniques are also performed during

• Clients
• Environmental Conditioning and Accelerated Testing
• Failure Analysis
• Material Characterization
• Optoelectronics
• Optomechanics
• Parts Selection and Management
• Performance Assessment and Uprating
• Software Development and Simulation
• Smart and Small Thermal Systems
• Electronic Parts Authentication and Screening
• CALCE-RWTT RoHS Testing
• Electronic System Cost Modeling