CALCE Part Selection and Management Publications

  1. M. Pecht and R. Biagini, The Business, Product Liability and Technical Issues Associated with Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, Pan Pacific Microelectronics Symposium and Tabletop Exhibit, pp. 391-398, Maui, Hawaii, February 5-7, 2002.

  2. Das, D. Pendse, N., Pecht, M., and C. Wilkinson, Parameter Recharacterization: A Method of Thermal Uprating, IEEE Transact IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 729-737, December, 2001.

  3. Condra, L., Das, D., Wilkinson, C., Pendse, N., and M. Pecht, Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers-Specified Temperature Ranges, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001.

  4. T. Syrus, M. Pecht, and R. Uppalapati, Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001.

  5. T. Syrus, M. Pecht, and D. Humphrey, Part Assessment Guidelines and Criteria for Parts Selection and Managemen, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 339-350, October 2001.

  6. Z. Huang, P. Sandborn, M. Pecht and R. Solomon, Life Cycle Forecasting of ASICs, Future Circuit International, Issue 7, pp. 101-107, Technology Publishing Ltd, London, UK, 2001.

  7. R. Solomon, P. Sandborn and M. Pecht, Electronic Part Life Cycle Concepts and Obsolescence Forecasting, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 707-717, December 2000.

  8. A. Ramakrishnan, T. Syrus and M. Pecht, Electronic Hardware Reliability, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.

  9. D. Humphrey, L. Condra, N. Pends, D. Das, C. Wilkinson and M. Pecht, An Avionics Guide to Uprating of Electronic Parts, IEEE Transactionson Components and Packaging Technologies, Vol. 23, No. 3, pp. 595-599, September, 2000.

  10. Das, D., Pendse, N., Pecht, M., Condra, L., and C. Wilkinson, Understanding Electronic Part Data Sheets for Parts Selection and Management, IEEE Circuits and Devices, Vol. 16, No. 5, pp. 26-34, September 2000.

  11. C. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Equipment Supplier Intervention Techniques, Future EMS International, No. 3, pp. 97-100, 2000.

  12. N. Pendse and M. Pecht, Parameter Re-characterization Case Study: Electrical Performance Comparison of the Military and Commercial Versions of all Octal Buffer, Future Circuits International, Vol. 6, pp. 63-67, Technology Publishing Ltd, London, UK, 2000.

  13. M. Pecht, D. Das, and L. Yang, Risk Assessment, Mitigation and Management - The Key Focus of Competitive Electronic Products Development in the 21st Century, Proceedings of the SEMICON Korea Technical Symposium 2000, Seoul, Korea, pp. 217-224, February 16, 2000.

  14. M. Pecht and D. Das, The Electronic Part Life Cycle, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March 2000.

  15. Condra, Lloyd, R. Hoad, D. Humphrey, T. Brennom, J. Fink, J. Heebink, C. Wilkinson, D. Marlborough, D. Das, N. Pendsé, and M. Pecht, Terminology for Use of Parts Outside Manufacturer-Specified Temperature Ranges, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 3, pp. 355-356, September 1999.

  16. Y. Zhang, D. Das, A. Katz, M. Pecht and O. Hallberg, Trends in Component Reliability and Testing, Semiconductor International, pp. 101-106, Sept. 1999.

  17. M. Jackson, P. Sandborn, M. Pecht, C. Hemens-Davis and P. Audette, A Risk-Informed Methodology for Parts Selection and Management, Quality and Reliability Engineering International, Vol. 15, pp. 261-271, September 1999.

  18. M. Jackson, A. Mathur, M. Pecht and R. Kendall, Part Manufacturer Assessment Process, Quality and Reliability Engineering International, Int. 15, pp. 457-468, 1999.

  19. Biagini, R., M. Rowland, M. Jackson, and M. Pecht, Tipping the Scales in Your Favor when Uprating, IEEE Circuits & Devices Magazine, pp. 15-22, July 1999.

  20. S. Lee, A. Katz, and C. Hillman, Getting the Quality and Reliability Terminology Straight, IEEE Transactions on IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 3, pp. 521-523, September 1998.

  21. B. Foucher, R. Kennedy, N. Kelkar, Y. Ranade, A. Govind, W. Blake, A. Mathur and R. Solomon, Why a New Parts Selection and Management Program?, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 375-378, June 1998.

  22. A. Dasgupta, E. Magrab, D. Anand, K. Eisinger, J. McLeish, M. Torres, P. Lall and T. Dishongh,Perspectives to Understand Risks in the Electronic Industry, IEEE Transaction on vCopmonents Packaging and Manufacturing Technology, Part A, Vol. 20, No. 4, pp. 542-547, December 1997.

  23. J. Jordan, M. Pecht, and J. Fink, How Burn-in can Reduce Quality and Reliability, The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 1, pp, 36-40, First Quarter, 1997.

  24. M. Pecht, J. Fink, E. Hakim and J. Wyler, An Assessment of the Qualified Manufacturer List (QML), IEEE Aerospace and Electronic Systems, Vol. 12, No. 7, pp. 39-43, July 1997.

  25. M. Wright, D. Humphrey and P. McCluskey, Uprating Electronic Components for Use Outside Teir Temperature Specification Limits, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 2, pp. 252-256, June 1997.

  26. P. Lall, M. Pecht, and E. Hakim, The Influence of Temperature on Microelectronic Device Reliability, CRC Press, Boca Raton, FL, 1997.

  27. Condra, L., Anissipour, A., Mayfield, D., and M. Pecht, Electronic Components Obsolescence, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 3, pp. 368-371, 1997.

  28. M. Pecht, Issues Affecting Early Affordable Access to Leading Electronic Technologies by the US Military and Government, Circuit World, Vol. 22, No. 2, 1996.

  29. M. Pecht, L. Nguyen and E. Hakim, Plastic Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications, John Wiley Publishing Co., New York, NY, 1995.

  30. E. Hakim, C. Rust and W. Olsson, Beyond the Qualified Manufacturer List (QML), Proceedings Annual Reliability and Maintainability Symposium, Washington DC, pp. 362-369, January 16-19, 1995.

  31. J. Pecht and M. Pecht, Long-term Non-operating Reliability of Electronic Products, CRC Press, Boca Raton, FL, 1995.

  32. M. Pecht, A. Dasgupta, J. Evans and J. Evans, Quality Conformance and Qualification of Electronic Packages, John Wiley Publishing Co., New York, NY, 1994.

  33. ]M. Pecht, Integrated Circuit, Hybrid and Multichip Module Package Design Guidelines, John Wiley Publishing Co., New York, NY, 1994.

  34. M. Pecht, J. She, J. Hu and K. Richter, Minimizing Life Cycle Costs, Concurrent Engineering, pp. 11-24, 1991.