CALCE Electronic Products and Systems Consortium
One of the major efforts of the CALCE Center is the CALCE Electronic Products and Systems Consortium, a successful international industry-government-academic partnership, sponsored by over 100 major international organizations from all sectors of the electronics industry. Consortium research projects are performed on an annual basis and are developed in collaboration with the Consortium members. For more information or to access a complete list of current projects click here. Recent Consortium projects of particular interest to the automotive industry are the following:

2004 Research Projects

• Logistics and Cost Analysis for Pb-free Implementation
• Risk Assessment & Accelerated Qualification of Pb-free Electronics
• Durability Characterization of Pb-free Solders
• Effect of Temperature Cycle on the Durability Pb-free Interconnects (Sn-Ag-Cu and Sn-Ag)
• Determination of Fatigue Constants of Pb-free Solder for calcePWA
• Intermetallic-Related Embrittlement of Pb-free Solder Die Attach
• Investigation of Issues on Pb-free Plating Pure Sn
• Characterization of Non-Conductive Adhesives for Flip-Chip-on-Flex Interconnects

2003 Research Projects

• Risks to Equipment Manufacturers from the Incremental Transition to Lead Free Electronics in the Supply Chain
• Calibration of Virtual Qualification Model for Leaded Packages with Lead-free Solder Materials
• Risk Assessment & Accelerated Qualification of Lead Free Electronics
• Characterization of Anisotropic Conductive Adhesives
• Durability Characterization of Lead-Free Solders continuation
• Corrosion of Eutectic and Lead-Free Solder
• Investigation of Tin Whiskers in Tin Finished Surfaces

2002 Research Projects

• Environmentally-Friendly Electronics in Japan
• Influence of Intermetallic on the Durability of Lead-Free Solder Interconnects
• Constitutive Relationships of Binary Lead-Free Solders
• Accelerated Thermal Cycling Tests for Lead-Free Assemblies
• Durability Characterization of Lead-Free Solders continued
• Degradation of High-Frequency Signals through Traces Plated with Alternative Finishes and Lead-Free Solder
• Electrical Characterization of Lead-Free Solder Separable Contact Interfaces continued
• Creep Corrosion Over Noble Plating Material
• Characterization of Anisotropic Conductive Adhesives

2001 Research Projects

• Constitutive Relationships of Lead-Free Solders Materials
• Durability of Lead-Free Solders
• Influence of Intermetallics on Durability of Lead-Free Solder Interconnects
• Characterization of Conductive Adhesives
• Effect of Lead Free Solder Reflow Profiles on the Component Integrity
• Electrical Characterization of Lead-Free Solder Separable Contact Interface