The CALCE Lead-Free Forum is dedicated to the collection, generation, organization, and dissemination of information related in the manufacture, assembly, and fielding of lead free and "green" electronic products and systems. The primary concerns raised by the removal of lead include solder interconnects and the tin whiskers.

Current Issues and Events:

The CALCE Lead-Free Forum is dedicated to the collection, generation, organization, and dissemination of information related to the manufacture, assembly, and fielding of lead free and "green" electronic products and systems.

• RoHS Review 1/3/2020 - This document aims to fill these two gaps in clarity for lead-related applications related lead-free exemptions that remain with RoHS2.
• Webseminar: DoD Lead-free Electronics Risk Mitigation: Lead-free Solder Basics for Systems Engineers
• Webseminar: DoD Lead-free Electronics Risk Mitigation: Program Management and Systems Engineering Overview Modeling Temperature Cycle Fatigue Life of Select SAC Solders
• A Perspective of the IPC Report on Lead-free Electronics in Military / Aerospace Applications
• Proceedings of Symposium on RoHS Impact of Printed Wiring Assembly Rework/Repair and Part Reprocessing (9/11/2007)

Solder Interconnects:

• On October 17, 2018, Dr. Osterman presented Modeling Temperature Cycle Fatigue Life of Select SAC Solders at SMTAI2018 in Chicago, IL

Tin Whiskers:

• CALCE Tin Whisker web site
• Webseminar: DoD Lead-free Electronics Risk Mitigation: Tin Whisker Basics for Systems Engineers
• CALCE Tin Whisker Risk Calculator
• Tin Whisker Risk Spreadsheet
• Tin Whisker Mitigation
• Whiskers Remain a Concern
• Proceedings of the 9th Interational Symposium on Tin Whiskers (2015)
• Proceedings of the 8th Interational Symposium on Tin Whiskers (2014)
• 7th International Symposium on Tin Whiskers (Nov 12-13, 2013)
• RoHS Recast: What You Need To Know (June 2011)
• 6th International Symposium on Tin Whiskers (Nov 27-28, 2012)
• 5th International Symposium on Tin Whiskers (Sept 14-15, 2011)
• 4th International Symposium on Tin Whiskers (June 23-24, 2010)
• 3rd International Symposium on Tin Whiskers (June 23-24, 2009)
• Workshop on Testing Lead-free Electronic Assemblies (4/14/2009)
• Symposium on Part Reprocessing, Tin Whisker Mitigation and Assembly Rework/Repair (11/12/2008)
• Second International Symposium on Tin Whiskers (4/24/2008)
• Briefing to LEAP Working Group (9/5/2007)
• International Symposium on Tin Whiskers (April 24-25, 2007)
• SMTA On-line Presentation (12/5/2006)
• CALCE Releases Tin Whisker Risk Assessment Software CALCE has released a new software for estimating the failure risk posed by tin whisker growth on electrical conductors in electronic hardware.
• CALCE Releases Pb-free Solder Fatigue Life Software CALCE has released a new software for estimating the life expectancy of solder joints in electronic hardware under temperature cycle loading. The new model is for SAC solder, the most widely adopted Pb-free solder.
• Lead-free Electronics A new reference book for Pb-free electronics is now available from CALCE EPSC Press. (CALCE Consortium Members)
• Tin Whisker Studies Information related to tin whiskers as a potential source of failure in electronic hardware.

Lead-Free Forum Point of Contact: M. Osterman

Please Email Inquires to - osterman@calce.umd.edu