7th International Symposium on Tin Whiskers
Novermber 12-13, 2013Hilton Orange County/Costa Mesa
3050 Bristol Street
Costa Mesa, CA 92626
|
|
|
Organized by
IPC
Center for Advanced Life Cycle Engineering ( CALCE )
Sponsored by
Lockheed Martin
Contact
Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
The Center of Advanced Life Cycle Engineering at the University of Maryland and IPC are pleased to announce the Seventh International Symposium on Tin Whiskers. Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices.
A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent.
Listing of proceeding of prior International Symposia on Tin Whiskers can be found at https://web.calce.umd.edu/tin-whiskers/symposia.htm
This symposium presentations can cover case histories, theories of tin whisker growth experiments and results, risk evaluation methods and risk mitigation strategies. Presentations submitted for this year’s symposium may cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.
Access to Material
Individuals who registered for the 7th International Sysmposium can access the material with a ISTW2013 Web Account
CALCE EPSC members can access these presentations with their existing EPSC Web Accounts.
Access to all symposium proceedings with a CALCE Articles Web Account
Contact
Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Presentations
|
Tuesday November 12th |
|||
|
Michael Osterman, CALCE |
|||
|
Real Time Study of Whiskers/Hillock Formation in Sn-Cu Systems During Thermal Cycling |
Eric Chason, Ph.D., Professor of Engineering, Brown University |
||
|
Thomas J. Hester, Senior Principal Multi-Disciplined Engineer, Component Engineering, Mechanical & Optical Engineering Center, Space and Airborne Systems, Raytheon Company |
|||
|
Pierre Eckold, M.Sc., Robert BOSCH GmbH |
|||
|
Wei-Hsun Chen, Ph.D. Candidate, Purdue University |
|||
|
Tin Whisker Formation from Electrodeposits Produced Using Non-Aqueous Ionic Liquid Electrolytes |
K. Christopher Stuttle, Ph.D. Candidate, Loughborough University |
||
|
Sn Whisker Growth and Microstructure Evolution During Thermal Cycling |
Ying Wang, Research Assistant, Purdue University |
||
|
Dave Hillman, Principal Materials and Process Engineer, Rockwell Collins |
|||
|
Characterization of Nanoparticle Enhanced Conformal Coatings for Whisker Mitigation |
Junghyung Cho, Ph.D. Professor of Mechanical Engineering, Binghamton University |
||
|
SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions |
Stephan Meschter, Ph.D., Mechanical Engineer, BAE Systems Electronic Solutions (Co-author is Polina Snugnovsky, Ph.D., Chief Metallurgist, Engineering Services, Celestica) |
||
|
Tuesday November 13th |
|||
|
Michael Osterman, CALCE (USA) |
|||
|
Linda Woody, Engineering Manager, Lockheed Martin |
|||
|
Conformal Coating Materials & Application: State of the Industry Assessment |
Dave Hillman, Principal Materials and Process Engineer, Rockwell Collins |
||
|
Tin Whisker Risk Mitigation at a Large Defense OEM – Past, Present and Future |
David Pinsky, Engineering Fellow, Raytheon |
||