CALCE Lead-free Articles

Lead-Free and Green Electronics Forum

Lead Free: Articles

CALCE faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 400 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the lead free electronics is presented below.

Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering, B. Sood, R. Sanapala, D. Das, M. Pecht, C. Huang, and M. Tsai, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, No. 2, pp. 98-111, April 2010

The Influence of H₂S Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing, S. Zhang, M. Osterman, A. Shrivastava, R. Kang, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol.10, No.1, pp. 71-81, March 2010

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, Lei Nie, Michael Osterman, Fubin Song, Jeffery Lo, S. W. Ricky Lee and Michael Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 32, No. 4, pp. 901-908, December 2009

Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates, R. Sanapala, B. Sood, D. Das, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 32, No. 4, pp. 272-280, October 2009

Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests, Y. Zhou and M. Pecht, 55th Annual IEEE Holm Conference, Vancouver, British Columbia, Canada, pp. 321-330, September 14-16, 2009.

Tin Whisker Reliability in Microelectronics, T. Shibutani, Q. Yu, and M. G. Pecht, Micromaterials and Nanomaterials, Issue 9, pp. 49-53, 2009.

Examination of Nickel Underlayer as a Tin Whisker Mitigator , Lyudmyla Panashchenko and Michael Osterman, Electronic Component and Technology Conference, May 2009.

Environmental Regulations in Lead-free and Halogen-free Electronics, L. Nie, J. Cai, M. Pecht, and R. Ciocci, Electronics & Packaging (Chinese), Vol. 9, No. 6, pp. 42-47, June 2009.

Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies using RF Impedance Analysis, D. Kwon, M. H. Azarian, M. Pecht, IEEE Electronic Components and Technology Conference, San Diego, CA, pp. 663-667, May 2009.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, Equipment for Electronic Products Manufacturing (Chinese), pp. 1-5, February 2009.

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies, L. Nie, M. Osterman, and M. Pecht, SMTA Journal, Vol. 22, No. 2, pp. 13-20, 2009.

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies, L. Nie, M. Osterman, and M. Pecht, IPC APEX 2009, Las Vegas, NV, March 31-April 2, 2009.

Standards for Tin Whisker Test Methods on Lead-Free Components, Tadahiro Shibutani, Michael Osterman, and Michael Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, pp. 216-219, March 2009.

Evaluation of Pure Tin Plated Copper Alloy Substrates for Tin Whiskers, S. Mathew, M. Osterman, M. Pecht, and F. Dunlevey, Circuit World, Vol. 35, No. 1, pp. 3-8, 2009.

Pressure-induced Tin Whisker Formation, T. Shibutani, Q. Yu, M. Shiratori, M. Pecht, Microelectronics Reliability, Vol. 48, pp. 1033-1039, 2008

Vibration Durability of Mixed Solder Interconnects, Gustavo Plaza, Dr. Michael Osterman, Prof. Michael Pecht, 41st International Symposium on Microelectronics, Providence, RI, Nov. 4-6, 2008.

Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board laminates R. Sanapala, B. Sood, D. Das, M. Pecht, C.Y. Huang, and M.Y. Tsai, EMAP, 2008.

Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections, Matkowski P., Urbanski K., Falat T., Felba J., Zaluk Z., Zwierta R., Dasgupta A., Pecht M., 2nd Electronics System integration Technology Conference, London-Greenwich, 2008, p.1375-1379

Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, K. Holdermann, G. Cuddalorepatta, and A. Dasgupta, ASME IMECE, Paper Number IMECE2008-67671, Nov 2008, Boston, MA.

Effect of Primary Creep Behavior on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects, G. Cuddalorepatta, and A. Dasgupta, Proceedings, EuroSiME Conference, April 2008, Freiburg, Germany.

Damage Initiation and Propagation in Voided Joints, Ladani, L. and Dasgupta, A., ASME Journal of Electronic Packaging, Vol 130, Issue 1, 011008, March 2008.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, APEX 2008, Las Vegas, Nevada, March 30th - April 3rd, 2008.

Microstructure and Intermetallics Formation in SnAgCu BGA Components attached with SnPb Solder under Isothermal Aging, A. Choubey, M. Osterman, and M. Pecht. IEEE Transactions on Device and Materials Reliability, Vol 8, Issue 1, pp 160-167, 2008.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 8, Issue 1, pp 182-192, March 2008

Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, M. Osterman and M. Pecht, Soldering & surface Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.

Creep and Stress Relaxation of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-free Alloy: Testing and Modeling, G. Cuddalorepatta and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb SOlders under Harmonic Excitation, Y. Zhou and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Tin Whiskers: How to Mitigate and Manage the Risks, S. Mathew, M. Osterman, T. Shibutani, Q. Yu and M. Pecht, Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, Shanghai, China, June 26-28, 2007.

Regulations and Market Trends in Lead-free and Halogen-free Electronics, L. Nie and M. Pecht, Circuit World, Vol. 33, NO. 2, pp. 4-9, 2007.

Reliability Assessment on Insertion Mount Assembly under Vibration Conditions, H. Qi, G. Plaza, S. Ganesan, M. Osterman, and M. Pecht, 2007 Electronic Components and Technology Conference, Reno, Nevada, pp. 407-414, May 29-June 1, 2007

Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process, S. Sengupta, D. Das, S. Ganesan, W. Rollins, D. Pinsky, T. Lin and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, NO. 2, pp. 128-137, April, 2007.

Assessment of Risk Resulting from Unattached Tin Whisker Bridging, T. Fang, S. Mathew, M. Osterman, and M. Pecht, Circuit World, Vol. 33, No. 1, pp. 5-8, 2007.

Durability of Repaired and Aged Lead-free Electronic Assemblies, A. Choubey, M. Osterman, M. Pecht, and D. Hillman, IPC Printed Circuits Expo, APEX, and Designers Summit, Los Angeles, CA. Feb 18-22, 2007

The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, January, 2007.

Vibration Durability Comparison of Sn37Pb vs SnAgCu SOlders, Y. Zhou, E. Scanff, and A. Dasgupta, 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 5-10, 2006.

The Effect of Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No. 4, pp. 252-258, October 2006.

Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, December, 2006.

Impact of Environmental Regulations on Green Electronics Manufacture, R. Ciocci and M. Pecht, Microelectronics International, Vol. 23, No. 2, pp 45-50, 2006.

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages, T. Lin, M. Pecht, D. Das, and K. Teo, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 522- 527, July 2006.

Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux, S. Zhan, M. Azarian, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 217-233, July 2006.

Contact Resistance and Fretting Corrosion of Lead-free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 402-410, June, 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, ITHERM Conference, San Deigo, CA, May 30, 2006.

Statistical Analysis of Tin Whisker Growth, T. Fang, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.

A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects , M. Osterman, A. Dasgupta, B. Han, 56th Electronic Component and Technology Conference, pp. 884 - 890, May 30-June 2, 2006

Learning from the Migration to Lead-free Solder, R. Ciocci and M. Pecht, Soldering & Surface Mount Technology, Vol. 18, No. 3, 2006.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, Capacitor and Resistor Technology Symposium, Orlando, FL, pp. 15-25, April 3-6, 2006.

Lead-Free Assemblies in High Temperature Applications, A. Choubey, J. Wu, S. Ganesan, and M. Pecht, Proceeding of IMAPS International Conference on High Temperature Electronics (HITECH 2006), pp. 384-389, May 2006.

Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components, A. Choubey, D. Menschow, S. Ganesan, and M. Pecht, Journal of SMTA, Vol. 19, Issue 2, pp. 33-37, April 2006.

Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, G. Cuddalorepatta and A. Dasgupta, ASME International Mechanical Engineering Congress and RD&D Expo, Orlando, FL, November 5-11, 2005.

Effects of Re-Finishing of Terminations by Solder-Dipping on Plastic Quad Flatpack Electronic Parts, S. Sengupta, D. Das, S. Ganesan, and M. Pecht, EPTC Annual Conference, Singapore, December 2005.

Lead-free Assembly Defects in Plastic Ball Grid Array Packages, S. Ganesan, G. Kim, J. Wu, M. Pecht, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 219-223, Wroclaw, Poland, October 23-26, 2005.

Effects Printed Circuit Board Materials on Lead-free Interconnect Durability, H. Qi, S. Ganesan, J. Wu, M. Pecht, P. Matkowski, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 140-144, Wroclaw, Poland, October 23-26, 2005.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Reliability Issues of No-Clean Flux Technology with Lead-Free Solder Alloy for High Density Printed Circuit Boards, S. Zhan, M. Azarian, and M. Pecht, 38th International Symposium on Microelectronics, pp. 367-375, Philadelphia, PA, September 25-29, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Mixed Flowing Gas Studies of Creep Corrosion on Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-Plated Leadframes, P. Zhao, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.

Key Concerns in the Assembly of Lead-Free Electronics, V. Eveloy, Y. Fukuda, S. Ganesan, J. Wu, and M. Pecht, Proceedings IMAPS Taiwan 2005 International Technical Symposium, pp. 167-183, June 2005.

Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders, S. Yoon, Z. Chen, M. Osterman, B. Han, and A. Dasgupta, 55th ECTC, pp. 1210-1214, June 2005.

Assessment of Long-term Reliability in Lead-free Assemblies, S. Ganesan, J. Wu, and M. Pecht, International Conference on Asian Green Electronics, Session 3, pp. 140-155, Shanghai, China, March 15-18, 2005.

The Impact of Lead-Free Legislation Exemptions on the Electronics Industry, M. Pecht, Y. Fukuda and S. Rajagopal, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 4, pp. 221-232, October 2004.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Has the Electronics Industry Missed the Boat on Pb-Free Failures in Ceramic Capacitors with Pb-Free Solder Interconnects, N. Blattau and C. Hillman, IPC/JEDEC 5th International Lead Free Conference on Electronic Components and Assemblies, San Jose, CA, March 18-19, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Questions Concerning the Migration to Lead-Free Solder, R. Ciocci, and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.

Ganesan, S., and Pecht, M., 2004, Lead-free Electronics, CALCE EPSC Press, College Park, MD, USA.

Assessing Lead-Free Intellectual Property, P. Casey and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.

Evaluation of Selected Japanese Lead-Free Consumer Electronics, Y. Fukuda, P. Casey, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 4, pp. 305-312, October 2003.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, The SMTA International Annual Conference, Chicago, IL, September 21-25, 2003.

Lead-Free Soldering in the Japanese Electronics Industry, Y. Fukuda, M. Pecht, K. Fukuda and S. Fukuda, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 616-624, September 2003.

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswel,l and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.

Field Failure Due to Creep Corrosion on Components with Palladium Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics Reliability, Vol. 43, No. 5, pp. 775-778, 2003.

The Technical, Social and Legal Outlook for Lead-Free Solders, P. Casey and M. Pecht, IEEE International Symposium on Electronic Material and Packaging, pp. 483-492, Kaohsiung, Taiwan, December, 2002.

Challenges for Adopting Pb-Free Interconnects for "Green" Electronics, P. Casey and M. Pecht, IPC/JEDEC International Conference on Lead-Free Electronic Components and Assemblies, pp. 21-32, Taipei, Taiwan, December 10-12, 2002.

Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure, Q. Zhang, P. Haswell, A. Dasgupta, and M. Osterman, 34th International SAMPE Technical Conference, Baltimore, MD, November 4-7, 2002.

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell, and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu, Y. Zheng, C. Hillman, and P. McCluskey, presented on Proceedings of the 52nd Electronic Components & Technology Conference, pp. 1226-1231, San Diego CA, 2002.

Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Journal of Surface Mount Technology, Vol. 14, Issue. 2, pp. 25-29, June 2002. Also presented at Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002.

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints, Y. Zheng, C. Hillman, and P. McCluskey, presented on AESF SUR/FIN 2002 Chicago IL, June 24-27, 2002.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; Part I: Viscoplastic Constitutive Properties; and Part II: Cyclic Durability Properties, P. Haswell, A. Dasgupta, and A. Paper, MRS Proceedings, N2.1, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago IL, 2001.

Lead-free Solder Replacement: Beyond the Material Substitution, R. Ciocci, Environmentally Conscious Manufacturing II, Vol. 4569, pp. 100-108, Newton, USA, 28-29, October 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, July 29-31, 2001, Roanoke, VA.

Fatigue and Intermetallic Formation in Lead Free Solder Die Attach, P. McCluskey, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai HI, July 9-13, 2001.

Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.

Lead-free Electronics A new reference book for Pb-free electronics is now available from CALCE EPSC Press. (CALCE Consortium Members)

Tests on the Relationship between the Oxide Thickness of CMOS Chips and Their Resistance to Gamma Radiation, A. Tokuhiro, M. Bertino, H. Dharavat, J. Munson, J. Farmer, M. Pecht, and D. Das.

Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy, Y. Deng, M. Pecht, and K. Rogers.

Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, EEE Transactions on Device and Materials Reliability.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, Capacitor and Resistor Technology Symposium, Orlando FL, pp. 15-25, April 3-6, 2006.

Electronic Device Encapsulation Using Red Phosphorus Flame Retardants, M. Pecht and Y. Deng, Microelectronics Reliability, Vol. 46, Issue 1, pp. 53-62, January 2006.

Failures in Semiconductor Device Encapsulated with Red Phosphorus Flame Retardant, Y. Deng and M. Pecht, 11th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, pp. 399-404, January 17-19, 2006.

The Story Behind the Red Phosphorus Mold Compound Device Failures, Y. Deng and M. Pecht, 2005 International Symposium on Electronics Materials and Packaging (EMAP2005), pp. 1-5, Tokyo, Japan, December 11-14, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Key Concerns in the Assembly of Lead-Free Electronics, V. Eveloy, Y. Fukuda, S. Ganesan, J. Wu, and M. Pecht, Proceedings IMAPS Taiwan 2005 International Technical Symposium, pp. 167-183, June 2005.

Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, Proceedings of 2004 International IEEE Conference on Asian Green Electronics, pp. 127-125, 2004.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Questions Concerning the Migration to Lead-free Solder, R. Ciocci, and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.

Assessing Lead-free Intellectual Property, P. Casey and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.

Evaluation of Selected Japanese Lead-Free Consumer Electronics, Y. Fukuda, P. Casey and M. Pecht, IEEE Transactions on Electronics Packaging Manufactruing, Vol. 26, No. 4, pp. 305-312, October 2003.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Envirionments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, A. Dasgupta, The SMTA International Annual Conference, September 21-25, 2003, Chicago, IL, USA.

Lead-Free Soldering in the Japanese Electronics Industry, Y. Fukuda, M. Pecht, K. Fukuda and S. Fukuda,IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 616-624, September, 2003.

Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswell and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.

Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure, Q. Zhang, P. Haswell, A. Dasgupta and Michael Osterman, 34th International SAMPE Technical Conference, Baltimore, MD, November 4-7, 2002.

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

Impact of environmental Regulations on Electronics Manufacture, Use and Disposal, R. Ciocci, J. Wu and M. Pecht, European Microelectronics Packaging and Interconnection Symposium Cracow, Poland, pp. 73-80, June 16-18, 2002.

Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu, Y. Zheng, C. Hillman, P. McCluskey, to be presented on Proceedings of the 52nd Electronic Components & Technology Conference, San Diego, 2002.

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints, Y. Zheng, C. Hillman, P. McCluskey, to be presented on AESF SUR/FIN 2002 June 24-27, Navy Pier, Chicago, IL.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; PartI: Viscoplastic Constitutive Properties; and PartII: Cyclic Durability Properties, Haswell,P. and Dasgupta, A. Paper N2.1, MRS Proceedings, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago, 2001.

Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Journal of Surface Mount Technology, Vol. 14, Issue. 2, June 2002. Also presented at Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002

Lead-free Solder Replacement: Beyond the Material Substitution, R. Ciocci, Environmentally Conscious Manufacturing II, Vol. 4569, pp. 100-108, Newton, USA, 28-29, October 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, July 29-31, 2001, Roanoke, VA.