6th International Symposium on Tin Whiskers

Novermber 27-28, 2012
Ford College, Loughborough University Leicestershire, UK LE11 3TU

View Agenda

Organized by

Department of Materials Research at Loughbourugh University

Center for Advanced Life Cycle Engineering ( CALCE )

Contact

Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu

Dr Geoffrey D. Wilcox, Department of Materials Research, G.D.Wilcox@lboro.ac.uk

The Center of Advanced Life Cycle Engineering at the University of Maryland and Department of Materials Research at Loughbourugh University are pleased to announce the Sixth International Symposium on Tin Whiskers. Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices.

A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent.

Listing of proceeding of prior International Symposia on Tin Whiskers can be found at http://www.calce.umd.edu/tin-whiskers/symposia.htm

This symposium presentations can cover case histories, theories of tin whisker growth experiments and results, risk evaluation methods and risk mitigation strategies. Presentations submitted for this year’s symposium may cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.

View Agenda

Access to Material

Individuals who registered for the 6th International Sysmposium can access the material with a ISTW2012 Web Account

CALCE EPSC members can access these presentations with their existing EPSC Web Accounts.

Access to all symposium proceedings with a CALCE Articles Web Account

Contact

Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu


Speaker Bios

Presentations

Tuesday November 27th

Welcome to Loughborough

Geoffrey Wilcox, University of Loughborough (UK)

 

Open Symposium

Michael Osterman, CALCE

 

Tin Whisker Risk Management for High Reliability Systems

Abstract   Presentation

Bob Gregory, Rolls-Royce (UK)

 

Manufacturing and In-service Tin Whisker Mitigation Strategies: The Co-deposition of Particulates and Conformal Coating

Abstract   Presentation

M.A. Ashworth, University of Loughborough (UK)

 

Development of Shape Varieties of Whisker Formations on Bright Tin Layers

Abstract   Presentation

Barbara Horváth, National Institute for Materials Science (Hungary)

 

Tin Whisker and Hillock Growth via Grain Boundary Sliding Coupled with Shear Induced Grain Boundary Migration

Abstract   Presentation

Pylin Sarobol, Purdue University (USA)

 

Thermal Cycling Whiskers and Influence of Atmosphere

Abstract   Presentation

K. Sugunuma, Osaka University (Japan)

 

Increased Shorting in Sn Whiskers due to Electric Fields and Contact Pressure

Abstract   Presentation

M. Wickham, NPL and B. Dunn, ESA

 

Whisker Growth in Low and High Stress Environments: Metallurgical Assessment and Statistical Analysis Part 1. Metallurgical Assessment

Abstract   Presentation

Polina Snugovsky, Celestica (Canada)

 

Whisker Growth in Low and High Stress Environments: Metallurgical Assessment and Statistical Analysis Part 2 Statistics

Abstract   Presentation

Steph Meschter, BAE (USA)

 

A Solution to Tin Whiskers by Hot Solder Dipping

Abstract   Presentation

Mark Walmsley, Micross Components (UK)

 

A Cure for Tin Whiskers by Re-passivation

Abstract   Presentation

Michael Swanwick, Rolls-Royce (UK)

 

Effectiveness of Photosintering in Mitigating Tin Whisker Formation

Abstract   Presentation

M. Osterman, CALCE

 

Adjourn

 

Tuesday November 28th

 

Electrical Aspects of Zinc and Tin Metal Whisker Induced Failures In Electric Equipment

Abstract   Presentation

Michael Osterman, CALCE (USA)

 

Novel nanoparticle enhanced conformal coating for whisker mitigation

Abstract   Presentation

Steph Meschter, BAE (USA)

 

The Mitigation of Tin Whiskers by Optimization of Electroplating Process Methodologies

Abstract   Presentation

M.A. Ashworth, Loughborough University (UK)

 

An Investigation into the Role of Lead as a Suppressant for Tin Whisker Growth in Electronics

Abstract   Presentation

Jing (Jacob) Wang, Loughborough University (UK)

 

Study of Tin Whisker Inhibiting Systems Controlling the copper substrate roughness Controlling the tin deposit crystal structure

Abstract   Presentation

George Milad, Uyemura (USA)