6th International Symposium on Tin WhiskersFord College, Loughborough University Leicestershire, UK LE11 3TU
Organized by Department of Materials Research at Loughbourugh University Center for Advanced Life Cycle Engineering ( CALCE ) Contact Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu Dr Geoffrey D. Wilcox, Department of Materials Research, G.D.Wilcox@lboro.ac.uk
The Center of Advanced Life Cycle Engineering at the University of Maryland and Department of Materials Research at Loughbourugh University are pleased to announce the Sixth International Symposium on Tin Whiskers. Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent. Listing of proceeding of prior International Symposia on Tin Whiskers can be found at http://www.calce.umd.edu/tin-whiskers/symposia.htm This symposium presentations can cover case histories, theories of tin whisker growth experiments and results, risk evaluation methods and risk mitigation strategies. Presentations submitted for this year’s symposium may cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.
Access to Material
Individuals who registered for the 6th International Sysmposium can access the material with a ISTW2012 Web Account CALCE EPSC members can access these presentations with their existing EPSC Web Accounts. Access to all symposium proceedings with a CALCE Articles Web Account
Contact Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Speaker Bios
Tuesday November 27th Welcome to Loughborough Geoffrey Wilcox, University of Loughborough (UK) Michael Osterman, CALCE Tin Whisker Risk Management for High Reliability Systems Bob Gregory, Rolls-Royce (UK)
Manufacturing and In-service Tin Whisker Mitigation Strategies: The Co-deposition of Particulates and Conformal Coating
M.A. Ashworth, University of Loughborough (UK)
Development of Shape Varieties of Whisker Formations on Bright Tin Layers Barbara Horváth, National Institute for Materials Science (Hungary)
Tin Whisker and Hillock Growth via Grain Boundary Sliding Coupled with Shear Induced Grain Boundary Migration
Pylin Sarobol, Purdue University (USA)
Thermal Cycling Whiskers and Influence of Atmosphere
K. Sugunuma, Osaka University (Japan)
Increased Shorting in Sn Whiskers due to Electric Fields and Contact Pressure
M. Wickham, NPL and B. Dunn, ESA
Whisker Growth in Low and High Stress Environments: Metallurgical Assessment and Statistical Analysis Part 1. Metallurgical Assessment Polina Snugovsky, Celestica (Canada)
Whisker Growth in Low and High Stress Environments: Metallurgical Assessment and Statistical Analysis Part 2 Statistics Steph Meschter, BAE (USA)
A Solution to Tin Whiskers by Hot Solder Dipping Mark Walmsley, Micross Components (UK)
A Cure for Tin Whiskers by Re-passivation Michael Swanwick, Rolls-Royce (UK)
Effectiveness of Photosintering in Mitigating Tin Whisker Formation M. Osterman, CALCE
Adjourn
Tuesday November 28th
Electrical Aspects of Zinc and Tin
Metal Whisker Induced Failures In Electric Equipment Michael Osterman, CALCE
(USA)
Novel nanoparticle enhanced conformal coating for whisker mitigation Steph Meschter, BAE
(USA)
The Mitigation of Tin Whiskers by Optimization of Electroplating Process Methodologies M.A. Ashworth, Loughborough University (UK)
An Investigation into the Role of Lead as a Suppressant for Tin Whisker Growth in Electronics
Jing (Jacob) Wang, Loughborough University (UK)
Study of Tin Whisker Inhibiting Systems
Controlling the copper substrate roughness
Controlling the tin deposit crystal structure
George Milad, Uyemura (USA)
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