Tin Whiskers

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Over the past five years, CALCE has been involved in research related to the phenomenon of tin whiskers. Tin whiskers represent a challenge to the electronics industry due our inability to predict or accelerate growth. Below are overviews of research efforts related to tin whiskers:

• Whisker Farm Growth Measurements
• Electrical Aspects on Tin Whisker Failures
• PoF Model of Conformal Coating against Tin Whisker Growth: Performance Evaluation under Operating and Storage Conditions
• Evaluation of Conformal Coat for Tin Whisker Mitigation
• Assessment of Tin Whisker Arcing Potential
• Long Term Reliability Evaluation of Conformal Coats for Tin Whisker Failure Mitigation
• Effectiveness of Tin Whisker Removal and Impact of Corrosion on Whisker Growth
• Tin Whisker Properties and Failure Mitigation Offered by Conformal Coats
• Tin Whisker Shorting Propensity and Growth Assessment
• Tin Whisker Growth and Risk Assessment Update
• Tin Whisker Risk Metric and Mitigation Strategies for Electronic Assemblies
• Investigation of Issues on Pb-free Plating Pure Sn
• Tin Whisker Risk Assessment