The CALCE Mixed (Pb-free Parts/SnPb Solder) Assembly Consortium Study was initiated in Fall 2006 to examine the reliability of interconnects formed in mixed (Pb-free Parts/SnPb Solder) assemblies. Testing includes:

• Temperature Cycling (-40 to 125 ^oC)
• Random Vibration
• Lead Pull Strength
• Microstructural Analysis

Study Participments

Emerson

Goodrich Control Systems, UK

Hamilton-Sunstrand

Lockheed Martin

Postings:

Impact of Board pad finish on the SnPb and Lead-free Solder Interconnect Reliability for Leadless Chip Resistors under Random Vibration Loading (Member Account Required)

Vibration Step Stress Test Report (Member Web Account Required)

Status Presentation May 2007 (Member Web Account Required)

Temperature Cycle (-40 to 125 ^oC) Test Data (Member Account Required)

Microstructural Analysis Report (Member Web Account Required)

Pull Strength Report (Member Web Account Required)

Point of Contact: M. Osterman