Root-Cause Failure Analysis of Electronic Products Course Overview Course Outline Related Texts Instructors Contact

Course Overview

This course will present a methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided. Example pictures and case studies will be presented. The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report.

Course Outline

1. Failure Mode Identification

2. Failure Mechanism Identification

• Component Packaging
• Boards and Substrates
• Interconnects (Solder Joints)
• Contacts and Connectors

3. Failure Analysis Techniques

• Non-destructive Analysis (NDA)
• Destructive Analysis
• Materials Characterization
• Accelerated Testing

4. Corrective and Preventative Actions

Related Texts

• Contamination of Electronic Assemblies
• Electronic Packaging: Materials and Their Properties
• Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Contact

Dr. Diganta Das
(301) 405-7770
diganta@umd.edu

Dr. Michael H. Azarian
(301) 405-7555
mazarian@calce.umd.edu

University of Maryland
College Park, MD 20742

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