About the Presenters

Junghyun Cho, State University of New York (SUNY) at Binghamton, Binghamton, New York, USA

Dr. Junghyun Cho is a Professor of the Department of Mechanical Engineering and a Co-Director of the Materials Science and Engineering Program at the State University of New York (SUNY) at Binghamton. He joined the University as an Assistant Professor in Fall 2001 after finishing a postdoctoral researcher appointment at the University of California, Santa Barbara (UCSB) (1999-2001). He received his Ph.D. in Materials Science and Engineering from Lehigh University (1998), M.S. in Materials Science and Engineering from Northwestern University (1993), and B.S. in Metallurgical Engineering from Yonsei University, Seoul, KOREA (1991). Before starting his graduate studies, Dr. Cho had worked at Samsung Electronics - Semiconductor R&D Center (Kihung, Korea) in the area of electronics packaging materials and processes (1990-91). He has also been a visiting professor in the Department of Metallurgy and Ceramics Science at Tokyo Institute of Technology, JAPAN (2009-2010).

Dr. Cho's research interests include thin films and coatings, processing science, microstructure design and mechanical behavior of ceramics and metals, and characterization of various types of materials at different length scales. His research has been supported from US federal and state government agencies as well as companies and industrial consortiums. His current industry partners include Analog Devices, BAE Systems, Universal Instruments, and GE.

Barrie Dunn, European Space Agency, the Netherlands

Barrie D. Dunn gained his B.Sc (Hons) in metallurgy and Ph.D. in materials science from Brunel University, UK. He joined the European Space Agency's Technology Centre in the Netherlands, moving to take up the position of Head of Metallic Materials and Processes Section within the same organisation in 1988. In 1998 he was promoted to Head of Materials and Processes Division. He "retired" from the European Space Agency in 2010 but continues to give support as Manufacturing Technology Expert to ESA, the EU and other organisations. He has supported all ESA space projects, particularly the telecommunications satellites, the manned Spacelab and International Space Station, and recently, the Vega Launcher programme and its launch site in French Guiana. He has maintained an interest in whiskers since performing a major failure analysis in the 70's that was found to have been caused by tin whisker growths. Dr Dunn has published more than 150 articles in the open literature and is the author of two books. "Metallurgical Assessment of Spacecraft Parts, Materials and Processes" is currently under revision with Springer Publishing AG.

David Hillman, Rockwell Collins, Cedar Rapids, Iowa, USA

David Hillman is a principal materials and process engineer in the Advanced Operations Engineering Department at Rockwell Collins Inc. His previous experience includes serving as a subject matter expert for the Lead-Free Manhattan Project and in 2011. In 2008 Hillman was recognized at the SMTA, by receiving the Member of Technical Distinction Award for his significant and continuing contribution to the association. Hillman was notably awarded the Da Vinci Medal as a Rockwell Engineer and currently serves as the chairman of the IPC J-STD-002 Solderability Committee. Prior to joining Rockwell, Hillman worked as a metallurgical engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis. As a member of the Surface Mount Technology Association Journal, he serves on the Soldering and Surface Mount Technology Journal Technical Paper Review Committees. He additionally serves as a member of IPC, the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and the Surface Mount Technology Association (SMTA).

Hillman graduated from Iowa State University and holds a Bachelor of Science degree and Master of Science degree in material science and engineering.

Werner Hügel, Robert Bosch, Stuttgart, Germany

Dr. Werner Hügel received his doctor degree in 2003 in physics from the University of Karlsruhe (Karlsruhe Institute of Technology). He joint Bosch in 2003 in the department of supplier quality management with focus on active electronic components. From 2004 until 2006 he worked on the definition of requirements of lead-free for the automotive electronics division. Main focus was the requirements for solder heat resistivity of components, soldering profile and the definition of lead-free surface finishes for electronic components. He contributed during this time the iNEMI activities and the standardization in IEC and JEDEC.

From 2007 until 2010 he supported the built up of the engineering center in Budapest (Hungary). From 2010 until now, Dr. Hügel is a member in the department of Engeneering Assembly and Interconnect Technology and is responsible for the backend technology, including the galvanic surface finishes as well as the solderability requirements for the automotive electronics division.

Victor Karpov, University of Toledo, Toledo Ohio, USA

Victor Karpov, professor of Physics at the Department of Physics and Astronomy, University of Toledo, has been involved with research in condensed matter, physical chemistry, physics of semiconductors, photovoltaics, and other device physics and reliability. He received Ph.D. from the State Technical University (St. Petersburg) and Doctor of Sciences from the Institute for Nuclear Physics of the Academy of Sciences of Russia.

Dr. Karpov worked for First Solar LLC, University of Chicago, Argonne National Lab, and St. Petersburg State Technical University. His collaborations include Ioffe Physical Technical Institute, Intel Co., General Mills, Nanosolar Inc., DyeSol Inc, and NREL. His research was funded by DOE, DOD, NSF, state of Ohio, and private industry. He published ~ 200 papers in refereed journals and presented invited talks to multiple meetings.

In the physics of noncrystalline solids, he put forward the concept of soft atomic potentials and their related low temperature thermodynamics and electronic phenomena. His recent work dealt with phase change memory where he contributed theories of field induced phase transformations, temporal drift of parameters, and conductive filament formation. In physical chemistry, he worked on nucleation in disordered systems and statistics of growing particles.

In thin film photovoltaics, Dr. Karpov developed the concept of lateral nonuniformities and their effects on device operations and reliability. This proved useful in mitigating serious reliability problems (the "Red wine effect" highlighted in the media). Also, highlighted in the media is Karpov's most recent work on metallic whiskers that proposes a theory of electrostatically driven whisker conception, growth, and statistics.

Stephan Meschter, BAE Systems Electronics, Endicott, New York, USA

Stephan Meschter, Ph.D., has 25 years of experience in advanced electronic packaging, electronics assembly mechanical failure analysis, and reliability testing of electronic assemblies at BAE Systems Electronic Systems in Endicott, NY and its heritage companies (General Electric, Martin Marietta and Lockheed Martin). He has designed and evaluated electronic assemblies for power, flight and jet engine control systems used in spacecraft, aircraft and ground vehicles. Dr. Meschter was a member of the 2009 U.S. DoD Lead-free Manhattan Project team tasked with the risk assessment of lead-free electronics in high reliability, harsh environment electronics in DoD applications. Dr. Meschter was the Aerospace Industries Association Pb-free electronics risk management (AIA-PERM) Consortium vice chairman and is currently supporting revision of several GEIA-STD-0005 lead-free aerospace and defense risk management documents. Dr. Meschter is currently the principle investigator on two U.S. DoD strategic environmental research and development projects (SERDP) that are examining corrosion induced whisker growth, conformal coatings for whisker mitigation and Monte Carlo whisker short circuit modeling.

Polina Snugovsky, Celestica, Toronto, Canada

Polina Snugovsky is a Global Metallurgical Consultant - Celestica, Toronto. She is currently focused on Whisker growth and Pb-free joint formation and failure analysis. Dr. Snugovsky graduated from the State Metallurgical Academy of Ukraine and received her Ph.D. in metallurgy, and than in 1985 she received a much higher level Doctoral degree in metallurgy and material Science. Before she joined Celestica in mid-1996 she worked as a full professor of the department of physical metallurgy of the State Metallurgical Academy of Ukraine. She is a specialist in eutectic type of materials and phase transformation. She has published over 140 papers and patented new materials and processes.

Lauren Shea Rohwer, Sandia National Laboratories, Albuquerque, New Mexico, USA

Lauren Shea Rohwer received her Ph.D. in Materials Science from the University of California, San Diego in 1997. She is currently a Principal Member of the Technical Staff at Sandia National Laboratories in Albuquerque, NM in the Microsystems Integration Department. Her research activities at Sandia have included synthesis and characterization of luminescent materials for solid-state lighting and displays; development of luminescence characterization methods; composite coatings for tin whisker mitigation; self-aligning patterns for sub-micron die/wafer alignment; and high-density interconnects for device integration.

Paul T. Vianco, Sandia National Laboratories

Paul T. Vianco received a Ph.D. degree in Materials Science from the University of Rochester (New York). He is currently a Distinguished Member of the Technical Staff at Sandia National Laboratories with over 25 years of experience there. His field of expertise is materials reliability of electronics used in weapon, space, and satellite applications. Paul is a fellow of the American Welding Society (AWS) and ASM, International.

Martin Wickham, National Physical Laboratory (NPL), Teddington, England

For the last 20 years, Martin has worked on research in the field of electronics interconnection as a consultant and at the UKs National Physical Laboratory. He has been joint author of over 70 reports, publications and international papers. His current interests are focused on Sn whiskers, printed electronics, sustainability in electronics manufacturing and harsh environment electronics. Work in Sn whiskers includes mitigation using conformal coatings, electrostatic attraction, contact resistance measurement, oxide breakdown and whisker growth under electric fields. He is also currently involved in several projects to improve sustainability in the electronics industry including increasing the recyclability of printed circuit assembles. Other recent work includes electrically conductive adhesives as replacements for SnPb solders, using sintered silvers as interconnects, moisture content measurement in PCBs and PCB via reliability.

Linda Woody, Lockheed-Martin, Ocala, FL, USA

Linda Woody is a member of the Lockheed Martin Production Technical Excellence staff as a Corporate SME for electronics assembly and soldering processes. She is responsible for new processes, process/equipment development, failure analysis, and serves as a liaison to Lockheed customers. She has been in the electronics industry for 36 years and she received a patent for her work in laser soldering in 2001. Linda is also the current Chair to the Lead free Electronics Risk Management consortia known as the PERM and has been working Lead free issues in the industry since the mid 90's. She was a member of the Lead free Manhattan project team which developed and published a book on Lead free Best Practices followed by a Technology Roadmap and research gaps analysis. Linda has supported the IPC standardization committees for over 18 years and has published many articles and papers over this time. Linda received the IPC President's Award in 2013. She continues working to improve and solve the present and future problems facing us as an industry.

Liang Wu, Loughborough University, Loughborough, England

Liang Wu (Loughborough University) holds a Master Degree in Materials Science and Engineering from Loughborough University, United Kingdom, in 2012. His dissertation was entitled 'A Study of the Oxide Chemistry on Tin Coatings using Sequential Electrochemical Reduction Analysis' and the related work is to be published. He subsequently received a Materials Research School Studentship to be a doctoral student at the Department of Materials, Loughborough University in 2013. His current project focuses on the investigation of whisker growth from zinc electrodeposits produced using different electroplating baths.