Detecting Counterfeit Risks by Material Change Tracking : A talk by Dr.Diganta Das
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Diganta Das (diganta@umd.edu) of CALCE will present on Detecting Counterfeit Risks by Material Change Tracking at the CALCE SMTA conference at College Park, Maryland on June 24th and 25th.
Abstract:
Purchasing and then inspecting to detect counterfeit parts is necessary the process may not be sustainable. Authentication through addition of external taggant is very promising but that is not applicable to parts that are already in circulation. Key to materials based authentication is built into a part with material characteristics and properties and this tool can be applied for all parts, latest and vintage alike.
The goal of this work is to be able to decide if a part is a counterfeit or not, without needing a genuine part to compare a part against. Along the years, modifications are made on the design of a part and its package. Among these changes, the molding compound is often modified reasons such as RoHS compliance, material property requirement, or material price. For each modification of the mold compound, the manufacturer typically issues a process change notice (PCN). If you have the manufacturing date of a part, you will know the mold compound and other materials. That material information is the key for this method. Use of the material information and tracking the changes over time provides a definitive method to
Bio:
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA. The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.
Purchasing and then inspecting to detect counterfeit parts is necessary the process may not be sustainable. Authentication through addition of external taggant is very promising but that is not applicable to parts that are already in circulation. Key to materials based authentication is built into a part with material characteristics and properties and this tool can be applied for all parts, latest and vintage alike.
The goal of this work is to be able to decide if a part is a counterfeit or not, without needing a genuine part to compare a part against. Along the years, modifications are made on the design of a part and its package. Among these changes, the molding compound is often modified reasons such as RoHS compliance, material property requirement, or material price. For each modification of the mold compound, the manufacturer typically issues a process change notice (PCN). If you have the manufacturing date of a part, you will know the mold compound and other materials. That material information is the key for this method. Use of the material information and tracking the changes over time provides a definitive method to
- Time stamp a part
- Assign a position to the part in a chronological sequence vis-a-vis previous and subsequent versions of the part
Bio:
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA. The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.