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Abstract

SiC power devices have demonstrated greater than twice the power density of Si power devices at greater efficiency, while also being able to operate at higher temperatures and voltages. However, power packaging approaches are now the limiting factor in fully realizing the performance benefits offered by SiC power device technology. In this study, a co-design approach that addresses electrical, thermal and thermomechanical issues in a coupled manner has been used to create a complete packaging solution that allows a full realization of the performance advantages of SiC devices. The result has been a thermal integrated 3D package designed to contain an entire full bridge DC-DC converter. This package uses multifunctional elements, additive manufacturing, and high frequency operation to provide dramatic improvements over current module technologies in packaging density, size, weight, cooling and in parasitic inductance and capacitance. We will discuss this packaging structure and the manufacturing steps used to create it.

About the Presenter:  Prof. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park. He is associated with the CALCE center where he is the principal investigator for projects related to packaging and reliability of electronic components for high power and high temperature environments. He is the author or co-author of over 150 technical articles on his research with nearly 3000 citations, and the co-author of three books. He has served as the technical program chair for several symposia and conferences in these research areas. He is a fellow of IMAPS, a senior member of IEEE, and a member of ASME/ He is currently a member-at-large on the Board of Governors of the IEEE Electronic Packaging Society.