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The warpage of advanced substrates and surface mount components is one of the most critical engineering quantities to the assembly yield. In spite of significant advancements in numerical modeling and optical methods, it is still difficult to predict and/or measure the warpage quantitatively.

This seminar reviews the current procedures to predict and measure the warpage. Selected results from each technique are presented to illustrate advantages and limitations. Technical challenges associated with accurate prediction and measurement are addressed and potential solutions are discussed.

About the speaker: Dr. Bongtae Han is Keystone Professor of Engineering and APT Chair of the Mechanical Engineering Department of the University of Maryland; and is currently directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering).

Dr. Han has co-authored a text book entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag (1997) and edited two books. He has published 12 book chapters and over 250 journal and conference papers in the field of microelectronics, photonics and experimental mechanics. He holds 2 US patents and 4 invention disclosures.

Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994. He was a recipient of the 2002 Society for Experimental Mechanics (SEM) Brewer Award for his contributions to development of photomechanics tools used in semiconductor packaging. Most recently, he was named the 2016 American Society of Mechanical Engineering (ASME) Mechanics Award winner in Electronic and Photonic Packaging Division for his contributions to structural mechanics of electronic systems. His publication awards include (1) the Year 2004 Best Paper Award of the IEEE Transactions on Components and Packaging Technologies, (2) the Gold Award (best paper in the Analysis and Simulation session) of the 1st Samsung Technical Conference in 2004 and (3) the Year 2015 Best Paper Award of the 16th International Conference on Electronic Packaging Technology (ICEPT 2015). His contributions to an innovative 1,500-face lumen LED luminaire, jointly developed with GE, have been recognized in a Press Release (Oct. 21, 2010, MarketWatch.com, The Wall Street Journal). He served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001, and Journal of Electronic Packaging, Transaction of the ASME from 2003 to 2012. He is currently serving as an Associate Editor for Microelectronics Reliability.

He was elected a Fellow of the SEM and the ASME in 2006 and 2007, respectively.