CALCE EPS Consortium Research for 2016
The following projects were presented to the CALCE EPS Consortium Members on October 22, 2015 and have been approved for study during the 2016 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Michael Osterman.
C16-01 | Comparison of Sequential vs Simultaneous Temperature Cycling and Harmonic Vibration Fatigue: LCR SAC305 Solder Fatigue |
C16-02 | Multiaxial Vibration Fatigue of PWAs: Interactions between PWB Nonlinear Response and Component Nonlinear Response |
C16-03 | Predictive Models for SAC Solder Properties |
C16-05 | Field Failure Rate Prediction of Solder Joint Fatigue Using Statistical Model Calibration and Validation |
C16-07 | Analytical Solder Interconnect Fatigue Life Models for Bonded Surface Mount Part |
C16-08 | Aging of Conformal Coating on Printed Wiring Boards |
C16-09 | Developing an Analytical Approach to Evaluate Copper Trace Fatigue Life in Electronic Assemblies |
C16-14 | Warpage Prediction of Advanced Package Substrate |
C16-15 | PoF Approach for Ranking the Behavior of Different Pressure Sensitive Adhesives PSAs |
C16-16 | Cyclic Fatigue of Selected High-Temperature Solders |
C16-17 | TLPS Joining Materials for Thermally Integrated Power Modules |
C16-19 | Life Estimation for Tantalum Capacitors with Conductive Polymer Electrolytes |
C16-21 | Graphene Interconnects for High VoltagePower Devices and Components |
C16-23 | Effectiveness of HALT and ESS Tests for Electronic Systems |
C16-24 | Reliability Assessment of Advanced Microstructures in Chip-scale Packages |
C16-25 | Physics of Failure Based Approach for Component Use Outside of Rated Temperatures |
C16-26 | Effects of Long Term Storage on Electronic Components |
C16-29 | FEA Model Integration with calceSARA |
C16-30 | Factors Impacting Surface Insulation Loss on Printed Wiring Boards |
C16-32 | Material Selection Criteria to Reduce Pad Cratering |