CALCE EPS Consortium Research for 2014
The following projects were presented to the CALCE EPS Consortium Members on October 23, 2013 and have been approved for study during the 2014 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Michael Osterman.
| C14-01 | Nonlinear Fatigue Model for Variable Temperature and Vibration in SAC Assemblies |
| C14-02 | Multiaxial Vibration Durability of Low-Standoff SMT Assemblies |
| C14-05 | Considerations for Implementing RoHS Compliant Electronics for Critical Applications |
| C14-08 | Evaluation of Novel Surface Coatings for Whisker Mitigation on Printed Wiring Board Assemblies |
| C14-09 | Evaluation of SACBi solder for printed wiring board assemblies. |
| C14-11 | Damage State Estimation in Solder Interconnects under Sequential Loading Conditions |
| C14-12 | Properties of High-Temperature Ag Nanopaste Interconnect Materials |
| C14-15 | Temperature and Humidity Degradation in Anisotropic Conductive Adhesive Interconnects |
| C14-17 | Impact of Extended Dwells on Solder Interconnect Reliability of Next Generation Solders |
| C14-18 | Reliability of Polymer Tantalum Capacitors: Surge Currents and Humidity |
| C14-19 | Vendor Qualification for Lithium Ion Batteries |
| C14-21 | Design Guidelines For Flexible Electronics with Graphene Interconnects |
| C14-22 | Comprehensive Viscoelastic Modeling of Advanced Polymers with Time-dependent Bulk Modulus |
| C14-23 | Microscopic Real-time Thermal Deformation Analyses by Advanced Portable Moire System |
| C14-24 | Next Generation Cooling of Power Electronics |
| C14-25 | Supply Management: Simulation Approach to Sourcing Optimization |
| C14-27 | Validation and Enhancement of Numerical Models Used in Prognostics and Health Management of Electronic Control Modules |
| C14-29 | Risk Assessment of Use of Taggants for Component Authentication |
| C14-30 | Electronic Component Technology Evaluation |
| C14-31 | Condition Based Monitoring of Electronic Equipment |
| C14-32 | Susceptibility of Resistors to Corrosion Failure |
| C14-35 | Effect of Assembly Warpage on Durability of SMT Leaded Interconnects |
| C14-36 | Mechanical Reliability of SMT Connectors and Switches |
| C14-39 | Screening Methods for Ensuring Reliability in Power Systems |
| C14-45 | Properties of High-Temperature Solder Interconnect Materials |