Industry and Military Specified Testing Methods
|
AUTHORITY |
STANDARD |
TEST METHOD |
TITLE |
|
JEDEC |
JESD-22 |
22-A100-A |
Cycled Temperature Humidity Bias Life Test |
|
JEDEC |
JESD-22 |
22-A101-B |
Steady State Temperature Humidity Bias Life Test |
|
JEDEC |
JESD-22 |
22-A102-B |
Accelerated Moisture Resistance - Unbiased Autoclave |
|
JEDEC |
JESD-22 |
22-A103-A |
High Temperature Storage Life |
|
JEDEC |
JESD-22 |
22-A104-A |
Temperature Cycling |
|
JEDEC |
JESD-22 |
22-A105-B |
Power and Temperature Cycling |
|
JEDEC |
JESD-22 |
22-A106-A |
Thermal Shock |
|
JEDEC |
JESD-22 |
22-A107-A |
Salt Atmosphere |
|
JEDEC |
JESD-22 |
22-A108-A |
Bias Life |
|
JEDEC |
JESD-22 |
22-A109 |
Hermeticity |
|
JEDEC |
JESD-22 |
22-A110-B |
Highly-Accelerated Temperature and Humidity Stress Test (HAST) |
|
JEDEC |
JESD-22 |
22-A112-A |
Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices |
|
JEDEC |
JESD-22 |
22-A113-B |
Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing |
|
JEDEC |
JESD-22 |
22-A114-A |
Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM) |
|
JEDEC |
JESD-22 |
22-A115-A |
Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM) |
|
JEDEC |
JESD-22 |
22-B100-A |
Physical Dimensions |
|
JEDEC |
JESD-22 |
22-B101 |
External Visual |
|
JEDEC |
JESD-22 |
22-B102-C |
Solderability |
|
JEDEC |
JESD-22 |
22-B103-A |
Vibration, Variable Frequency |
|
JEDEC |
JESD-22 |
22-B104-A |
Mechanical Shock |
|
JEDEC |
JESD-22 |
22-B105-A |
Lead Integrity |
|
JEDEC |
JESD-22 |
22-B106-B |
Resistance to Soldering Temperature for Through-Hole Mounted Devices |
|
JEDEC |
JESD-22 |
22-B107-A |
Marking Permanency |
|
JEDEC |
JESD-22 |
22-B108 |
Coplanarity Test for Surface-Mount Semiconductor Devices |
|
JEDEC |
JESD-22 |
22-C100-A |
High Temperature Continuity |
|
JEDEC |
JESD-22 |
22-C101 |
Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components |
|
IPC |
TM-650 |
2.1.1D |
Microsectioning - 3/98 |
|
IPC |
TM-650 |
2.1.1.1 |
Microsectioning, Ceramic Substrate - 12/87 |
|
IPC |
TM-650 |
2.1.1.2 |
Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93 |
|
IPC |
TM-650 |
2.1.2A |
Pinhole Evaluation, Dye Penetration Method - 3/76 |
|
IPC |
TM-650 |
2.1.3A |
Plated-Through Hole Structure Evaluation - 8/76 |
|
IPC |
TM-650 |
2.1.5A |
Surface Examination, Unclad and Metal Clad Material - 12/82 |
|
IPC |
TM-650 |
2.1.6B |
Thickness of Glass Fabric - 12/94 |
|
IPC |
TM-650 |
2.1.6.1 |
Weight of Fabric Reinforcements - 12/94 |
|
IPC |
TM-650 |
2.1.7C |
Thread Count of Glass Fabric - 12/94 |
|
IPC |
TM-650 |
2.1.7.1 |
Thread Count, Organic Fibers - 12/87 |
|
IPC |
TM-650 |
2.1.8B |
Workmanship - 12/94 |
|
IPC |
TM-650 |
2.1.9 |
Surface Scratch Examination Metal Clad Foil - 5/86 |
|
IPC |
TM-650 |
2.1.10A |
Visual Inspection for Undissolved Dicyandiamide - 12/94 |
|
IPC |
TM-650 |
2.1.13A |
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 |
|
IPC |
TM-650 |
2.2.1A |
Mechanical Dimensional Verification - 8/97 |
|
IPC |
TM-650 |
2.2.2B |
Optical Dimensional Verification - 8/97 |
|
IPC |
TM-650 |
2.2.4C |
Dimensional Stability, Flexible Dielectric Materials - 5/98 |
|
IPC |
TM-650 |
2.2.5A |
Dimensional Inspections Using Mircosections - 8/97 |
|
IPC |
TM-650 |
2.2.6A |
Hole Size Measurement, Drilled - 8/97 |
|
IPC |
TM-650 |
2.2.7A |
Hole Size Measurement, Plated - 5/86 |
|
IPC |
TM-650 |
2.2.8 |
Location of Holes - 4/73 |
|
IPC |
TM-650 |
2.2.10A |
Hole Location and Conductor Location - 12/83 |
|
IPC |
TM-650 |
2.2.12A |
Thickness of Copper by Weight- 3/76 |
|
IPC |
TM-650 |
2.2.12.1 |
Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87 |
|
IPC |
TM-650 |
2.2.12.2 |
Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 |
|
IPC |
TM-650 |
2.2.12.3 |
Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89 |
|
IPC |
TM-650 |
2.2.13.1A |
Thickness, Plating in Holes, Microhm Method - 1/83 |
|
IPC |
TM-650 |
2.2.14 |
Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 |
|
IPC |
TM-650 |
2.2.14.1 |
Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95 |
|
IPC |
TM-650 |
2.2.14.2 |
Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95 |
|
IPC |
TM-650 |
2.2.14.3 |
Determination of Maximum Solder Powder Particle Size - 1/95 |
|
IPC |
TM-650 |
2.2.15 |
Cable Dimensions (Flat Cable) - 6/79 |
|
IPC |
TM-650 |
2.2.16 |
Artwork Master Evaluation by Use of a Drilled Panel - 12/87 |
|
IPC |
TM-650 |
2.2.16.1 |
Artwork Master Evaluation by Overlay - 12/87 |
|
IPC |
TM-650 |
2.2.17 |
Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90 |
|
IPC |
TM-650 |
2.2.15 |
Determination of Thickness of Laminates by Mechanical Measurement - 12/94 |
|
IPC |
TM-650 |
2.2.15.1 |
Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 |
|
IPC |
TM-650 |
2.2.19 |
Measuring Hole Pattern Location-12/87 |
|
IPC |
TM-650 |
2.2.19.1 |
Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 |
|
IPC |
TM-650 |
2.2.20 |
Solder Paste Metal Content by Weight - 1/95 |
|
IPC |
TM-650 |
2.2.21 |
Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98 |
|
IPC |
TM-650 |
2.3.1 |
Chemical Processing, Suitable Processing Material- 4/73 |
|
IPC |
TM-650 |
2.3.1.1B |
Chemical Cleaning of Metal Clad Laminates- 5/86 |
|
IPC |
TM-650 |
2.3.2F |
Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 |
|
IPC |
TM-650 |
2.3.3A |
Chemical Resistance of Insulating Materials- 2/78 |
|
IPC |
TM-650 |
2.3.4B |
Chemical Resistance, Marking Paints and Inks - 8/97 |
|
IPC |
TM-650 |
2.3.4.2A |
Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94 |
|
IPC |
TM-650 |
2.3.4.3 |
Chemical Resistance of Core Materials to Methylene Chloride- 5/86 |
|
IPC |
TM-650 |
2.3.5B |
Density, Insulating Material - 8/97 |
|
IPC |
TM-650 |
2.3.6A |
Etching, Ammonium Persulfate Method - 7/75 |
|
IPC |
TM-650 |
2.3.7A |
Etching, Ferric Chloride Method - 7/75 |
|
IPC |
TM-650 |
2.3.7.1A |
Cupric Chloride Etching Method - 12/94 |
|
IPC |
TM-650 |
2.3.7.2A |
Alkaline Etching Method - 12/94 |
|
IPC |
TM-650 |
2.3.8A |
Flammability, Flexible Insulating Materials- 12/82 |
|
IPC |
TM-650 |
2.3.8.1 |
Flammability of Flexible Printed Wiring- 12/88 |
|
IPC |
TM-650 |
2.3.9D |
Flammability of Prepreg and Thin Laminate - 8/97 |
|
IPC |
TM-650 |
2.3.10B |
Flammability of Laminate - 12/94 |
|
IPC |
TM-650 |
2.3.10.1 |
Flammability of Soldermask on Printed Wiring Laminate- 8/98 |
|
IPC |
TM-650 |
2.3.11 |
Glass Fabric Construction- 4/73 |
|
IPC |
TM-650 |
2.3.13 |
Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95 |
|
IPC |
TM-650 |
2.3.14 |
Print, Etch, and Plate Test- 4/73 |
|
IPC |
TM-650 |
2.3.15C |
Purity, Copper Foil or Plating - 8/97 |
|
IPC |
TM-650 |
2.3.16B |
Resin Content of Prepreg, by Burn-off - 12/94 |
|
IPC |
TM-650 |
2.3.16.1C |
Resin Content of Prepeg, by Treated Weight--12/94 |
|
IPC |
TM-650 |
2.3.16.2 |
Treated Weight of Prepreg - 12/94 |
|
IPC |
TM-650 |
2.3.17D |
Resin Flow Percent of Prepreg - 8/97 |
|
IPC |
TM-650 |
2.3.17.1B |
Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 |
|
IPC |
TM-650 |
2.3.17.2B |
Resin Flow of "No Flow" Prepreg - 8/97 |
|
IPC |
TM-650 |
2.3.15A |
Gel Time, Prepreg Materials - 4/86 |
|
IPC |
TM-650 |
2.3.19C |
Volatile Content of Prepreg - 12/94 |
|
IPC |
TM-650 |
2.3.20 |
Plating Quality, Hull Cell Method - 8/97 |
|
IPC |
TM-650 |
2.3.22 |
Copper Protective Coating Quality - 2-78 |
|
IPC |
TM-650 |
2.3.23B |
Cure (Permanency) Thermally Cured Solder Mask - 2/88 |
|
IPC |
TM-650 |
2.3.23.1A |
Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88 |
|
IPC |
TM-650 |
2.3.24 |
Porosity of Gold Plating- 2/78 |
|
IPC |
TM-650 |
2.3.24.1 |
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85 |
|
IPC |
TM-650 |
2.3.24.2A |
Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97 |
|
IPC |
TM-650 |
2.3.25B |
Detection and Measurement of Ionizable Surface Contaminants - 8/97 |
|
IPC |
TM-650 |
2.3.26A |
Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94 |
|
IPC |
TM-650 |
2.3.26.1 |
Ionizable Detection of Surface Contaminants (Static Method) - 11/94 |
|
IPC |
TM-650 |
2.3.26.2 |
Mobile Ion Content of Polymer Films - 7/95 |
|
IPC |
TM-650 |
2.3.27 |
Cleanliness Test - Residual Rosin - 1/95 |
|
IPC |
TM-650 |
2.3.27.1 |
Rosin Flux Residue Analysis-HPLC Method - 1/95 |
|
IPC |
TM-650 |
2.3.28 |
Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 |
|
IPC |
TM-650 |
2.3.29 |
Flammability, Flexible Flat Cable- 11/88 |
|
IPC |
TM-650 |
2.3.30A |
Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 |
|
IPC |
TM-650 |
2.3.31 |
Relative Degree of Cure of U.V. Curable Material - 2/88 |
|
IPC |
TM-650 |
2.3.32C |
Flux Induced Corrosion (Copper Mirror Method)- 1/95 |
|
IPC |
TM-650 |
2.3.33C |
Presence of Halides in Flux, Silver Chromate Method - 1/95 |
|
IPC |
TM-650 |
2.3.34B |
Solids Content, Flux - 1/95 |
|
IPC |
TM-650 |
2.3.34.1B |
Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 |
|
IPC |
TM-650 |
2.3.35B |
Halide Content, Quantitative (Chloride and Bromide)- 1/95 |
|
IPC |
TM-650 |
2.3.35.1 |
Fluorides by Spot Test, Fluxes - Qualitative - 1/95 |
|
IPC |
TM-650 |
2.3.35.2 |
Flouride Concentration, Fluxes - Quantitative--1/95 |
|
IPC |
TM-650 |
2.3.36 |
Acid Acceptance of Chlorinated Solvents- 10/85 |
|
IPC |
TM-650 |
2.3.37B |
Volatile Content of Adhesive Coated Dielectric Films - 5/98 |
|
IPC |
TM-650 |
2.3.38B |
Surface Organic Contaminant Detection Test - 8/97 |
|
IPC |
TM-650 |
2.3.39B |
Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97 |
|
IPC |
TM-650 |
2.3.40 |
Thermal Stability - 7/95 |
|
IPC |
TM-650 |
2.4.1D |
Adhesion, Tape Testing--8/97 |
|
IPC |
TM-650 |
2.4.1.1B |
Adhesion, Marking Paints and Inks--11/88 |
|
IPC |
TM-650 |
2.4.1.2 |
Adhesion of Conductors on Hybrid Substrates--12/87 |
|
IPC |
TM-650 |
2.4.1.3 |
Adhesion, Resistors (Hybrid Circuits)--12/87 |
|
IPC |
TM-650 |
2.4.1.4 |
Adhesion, Overglaze (Hybrid Circuits)--12/87 |
|
IPC |
TM-650 |
2.4.1.5A |
Determination of Heat Transfer--5/95 |
|
IPC |
TM-650 |
2.4.1.6 |
Adhesion, Polymer Coating--7/95 |
|
IPC |
TM-650 |
2.4.2A |
Ductility of Copper Foil--3/76 |
|
IPC |
TM-650 |
2.4.2.1D |
Flexural Fatigue and Ductility, Foil--3/91 |
|
IPC |
TM-650 |
2.4.3D |
Flexural Fatigue, Flexible Printed Wiring Materials--5/98 |
|
IPC |
TM-650 |
2.4.3.1C |
Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 |
|
IPC |
TM-650 |
2.4.3.2C |
Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 |
|
IPC |
TM-650 |
2.4.4B |
Flexural Strength of Laminates (at Ambient Temperature)--12/94 |
|
IPC |
TM-650 |
2.4.4.1A |
Flexural Strength of Laminates (at Elevated Temperature)--12/94 |
|
IPC |
TM-650 |
2.4.5 |
Folding Endurance, Flexible Printed Wiring Materials--4/73 |
|
IPC |
TM-650 |
2.4.6 |
Hot Oil--4/73 |
|
IPC |
TM-650 |
2.4.7A |
Machinability, Printed Wiring Materials--7/75 |
|
IPC |
TM-650 |
2.4.8C |
Peel Strength of Metallic Clad Laminates--12/94 |
|
IPC |
TM-650 |
2.4.8.1 |
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 |
|
IPC |
TM-650 |
2.4.8.2A |
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94 |
|
IPC |
TM-650 |
2.4.8.3A |
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94 |
|
IPC |
TM-650 |
2.4.8.4 |
Carrier Release, Thin Copper--1/90 |
|
IPC |
TM-650 |
2.4.9D |
Peel Strength, Flexible Dielectric Materials--10/88 |
|
IPC |
TM-650 |
2.4.9.1 |
Peel Strength of Flexible Circuits - 11/98 |
|
IPC |
TM-650 |
2.4.9.2 |
Bonding Process - 11/98 |
|
IPC |
TM-650 |
2.4.10 |
Plating Adhesion--4/73 |
|
IPC |
TM-650 |
2.4.11 |
Shear Strength Flexible Dielectric Materials--4/73 |
|
IPC |
TM-650 |
2.4.12A |
Solderability, Edge Dip Method--6/91 |
|
IPC |
TM-650 |
2.4.13F |
Solder Float Resistance Flexible Printed Wiring Materials--5/98 |
|
IPC |
TM-650 |
2.4.13.1 |
Thermal Stress of Laminates--12/94 |
|
IPC |
TM-650 |
2.4.14 |
Solderability of Metallic Surfaces--4/73 |
|
IPC |
TM-650 |
2.4.14.1 |
Solderability, Wave Solder Method--3/79 |
|
IPC |
TM-650 |
2.4.14.2 |
Liquid Flux Activity, Wetting Balance Method--1/95 |
|
IPC |
TM-650 |
2.4.15A |
Surface Finish, Metal Foil--3/76 |
|
IPC |
TM-650 |
2.4.16A |
Initiation Tear Strength, Flexible Insulating Materials--12/82 |
|
IPC |
TM-650 |
2.4.17 |
Tear Strength, Propagation--4/73 |
|
IPC |
TM-650 |
2.4.17.1A |
Propagation, Tear Strength, Flexible Insulating Materials--12/82 |
|
IPC |
TM-650 |
2.4.15B |
Tensile Strength and Elongation, Copper Foil--8/80 |
|
IPC |
TM-650 |
2.4.15.1 |
Tensile Strength and Elongation, In-House Plating--8/97 |
|
IPC |
TM-650 |
2.4.15.2 |
Hot Rupture Strength, Foil--7/89 |
|
IPC |
TM-650 |
2.4.15.3 |
Tensile Strength, Elongation, and Modulus--7/95 |
|
IPC |
TM-650 |
2.4.19C |
Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 |
|
IPC |
TM-650 |
2.4.20 |
Terminal Bond Strength, Flexible Printed Wiring--4/73 |
|
IPC |
TM-650 |
2.4.21D |
Land Bond Strength, Unsupported Component Hole--8/97 |
|
IPC |
TM-650 |
2.4.21.1C |
Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 |
|
IPC |
TM-650 |
2.4.22C |
Bow and Twist (Percentage)--6/99 |
|
IPC |
TM-650 |
2.4.22.1C |
Bow and Twist-Laminate--5/93 |
|
IPC |
TM-650 |
2.4.22.2 |
Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 |
|
IPC |
TM-650 |
2.4.23 |
Soldering Resistance of Laminate Materials--3/79 |
|
IPC |
TM-650 |
2.4.24C |
Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94 |
|
IPC |
TM-650 |
2.4.24.1 |
Time to Delamination (TMA Method)--12/94 |
|
IPC |
TM-650 |
2.4.24.2 |
Glass Transition Temperature of Organic Films - DMA Method--7/95 |
|
IPC |
TM-650 |
2.4.24.3 |
Glass Transition Temperature of Organic Films - TMA Method--7/95 |
|
IPC |
TM-650 |
2.4.24.4 |
Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98 |
|
IPC |
TM-650 |
2.4.24.5 |
Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98 |
|
IPC |
TM-650 |
2.4.25C |
Glass Transition Temperature and Cure Factor by DSC--12/94 |
|
IPC |
TM-650 |
2.4.26 |
Tape Test for Additive Printed Boards--3/79 |
|
IPC |
TM-650 |
2.4.27.1B |
Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95 |
|
IPC |
TM-650 |
2.4.27.2A |
Solder Mask Abrasion (Pencil Method)--2/88 |
|
IPC |
TM-650 |
2.4.28B |
Adhesion, Solder Mask (Non-Melting Metals)--8/97 |
|
IPC |
TM-650 |
2.4.28.1B |
Adhesion, Solder Resist (Mask), Tape Test Method--8/97 |
|
IPC |
TM-650 |
2.4.29B |
Adhesion, Solder Mask, Flexible Circuit--2/88 |
|
IPC |
TM-650 |
2.4.30 |
Impact Resistance, Polymer Film--10/86 |
|
IPC |
TM-650 |
2.4.31A |
Folding, Flexible Flat Cable--4/86 |
|
IPC |
TM-650 |
2.4.32A |
Fold Temperature Testing, Flexible Flat Cable--4/86 |
|
IPC |
TM-650 |
2.4.33C |
Flexural Fatigue and Ductility, Flat Cable--3/91 |
|
IPC |
TM-650 |
2.4.34 |
Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95 |
|
IPC |
TM-650 |
2.4.34.1 |
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95 |
|
IPC |
TM-650 |
2.4.34.2 |
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95 |
|
IPC |
TM-650 |
2.4.34.3 |
Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95 |
|
IPC |
TM-650 |
2.4.34.4 |
Paste Flux Viscosity - T-Bar Spindle Method--1/95 |
|
IPC |
TM-650 |
2.4.35 |
Solder Paste - Slump Test--1/95 |
|
IPC |
TM-650 |
2.4.36B |
Rework Simulation, Plated-Through Holes for Leaded Components--8/97 |
|
IPC |
TM-650 |
2.4.37A |
Evaluation of Hand Soldering Tools for Terminal Connections--7/91 |
|
IPC |
TM-650 |
2.4.37.1A |
Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91 |
|
IPC |
TM-650 |
2.4.37.2 |
Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 |
|
IPC |
TM-650 |
2.4.38A |
Prepeg Scaled Flow Testing--6/91 |
|
IPC |
TM-650 |
2.4.39A |
Dimensional Stability, Glass Reinforced Thin Laminates--2/86 |
|
IPC |
TM-650 |
2.4.40 |
Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 |
|
IPC |
TM-650 |
2.4.41 |
Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86 |
|
IPC |
TM-650 |
2.4.41.1A |
Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97 |
|
IPC |
TM-650 |
2.4.41.2 |
Coefficient of Thermal Expansion - Strain Gage Method--8/97 |
|
IPC |
TM-650 |
2.4.41.3 |
In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 |
|
IPC |
TM-650 |
2.4.41.4 |
Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 |
|
IPC |
TM-650 |
2.4.42 |
Torsional Strength of Chip Adhesives--2/88 |
|
IPC |
TM-650 |
2.4.42.1 |
High Tempreature Mechanical Strength Retention of Adhesives--3/88 |
|
IPC |
TM-650 |
2.4.42.2 |
Die Shear Strength--2/98 |
|
IPC |
TM-650 |
2.4.42.3 |
Wire Bond Pull Strength--2/98 |
|
IPC |
TM-650 |
2.4.43 |
Solder Paste - Solder Ball Test--1/95 |
|
IPC |
TM-650 |
2.4.44 |
Solder Paste - Tack Test--3/98 |
|
IPC |
TM-650 |
2.4.45 |
Solder Paste - Wetting Test--1/95 |
|
IPC |
TM-650 |
2.4.46 |
Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95 |
|
IPC |
TM-650 |
2.4.47 |
Flux Residue Dryness--1/95 |
|
IPC |
TM-650 |
2.4.48 |
Spitting of Flux-Cored Wire Solder--1/95 |
|
IPC |
TM-650 |
2.4.49 |
Solder Pool Test--1/95 |
|
IPC |
TM-650 |
2.4.50 |
Thermal Conductivity, Polymer Films--7/95 |
|
IPC |
TM-650 |
2.4.51 |
Self Shimming Thermally Conductive Adhesives--1/95 |
|
IPC |
TM-650 |
2.5.1B |
Arc Resistance of Printed Wiring Materials--5/86 |
|
IPC |
TM-650 |
2.5.2A |
Capacitance of Insulating Materials--7/75 |
|
IPC |
TM-650 |
2.5.3B |
Current Breakdown, Plated Through Holes--8/97 |
|
IPC |
TM-650 |
2.5.4 |
Current Carrying Capacity, Multilayer Printed Wring--4/73 |
|
IPC |
TM-650 |
2.5.4.1A |
Conductor Temperature Rise Due to Current Changes in Conductors--8/97 |
|
IPC |
TM-650 |
2.5.5A |
Dielectric Constant of Printed Wiring Materials--7/75 |
|
IPC |
TM-650 |
2.5.5.1B |
Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 |
|
IPC |
TM-650 |
2.5.5.2A |
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87 |
|
IPC |
TM-650 |
2.5.5.3C |
Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87 |
|
IPC |
TM-650 |
2.5.5.4 |
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85 |
|
IPC |
TM-650 |
2.5.5.5C |
Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98 |
|
IPC |
TM-650 |
2.5.5.5.1 |
Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98 |
|
IPC |
TM-650 |
2.5.5.6 |
Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89 |
|
IPC |
TM-650 |
2.5.5.7 |
Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92 |
|
IPC |
TM-650 |
2.5.5.8 |
Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95 |
|
IPC |
TM-650 |
2.5.5.9 |
Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 |
|
IPC |
TM-650 |
2.5.6B |
Dielectric Breakdown of Rigid Printed Wiring Material--5/86 |
|
IPC |
TM-650 |
2.5.6.1A |
Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88 |
|
IPC |
TM-650 |
2.5.6.2A |
Electric Strength of Printed Wiring Material--8/97 |
|
IPC |
TM-650 |
2.5.6.3 |
Dielectric Breakdown Voltage and Dielectric Strength--10/86 |
|
IPC |
TM-650 |
2.5.7C |
Dielectric Withstanding Voltage, PWB--8/97 |
|
IPC |
TM-650 |
2.5.8A |
Dissipation Factor of Flexible Printed Wiring Material--7/75 |
|
IPC |
TM-650 |
2.5.10A |
Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87 |
|
IPC |
TM-650 |
2.5.10.1 |
Insulation Resistivity for Adhesive Interconnection Bonds--11/98 |
|
IPC |
TM-650 |
2.5.11 |
Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73 |
|
IPC |
TM-650 |
2.5.12 |
Interconnection Resistance, Multilayer Printed Wiring--4/73 |
|
IPC |
TM-650 |
2.5.13A |
Resistance of Copper Foil--3/76 |
|
IPC |
TM-650 |
2.5.14A |
Resistivity of Copper Foil--8/76 |
|
IPC |
TM-650 |
2.5.15A |
Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 |
|
IPC |
TM-650 |
2.5.16A |
Shorts, Internal on Multilayer Printed Wiring--11/88 |
|
IPC |
TM-650 |
2.5.17E |
Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98 |
|
IPC |
TM-650 |
2.5.17.1A |
Volume and Surface Resistivity of Dielectric Materials--12/94 |
|
IPC |
TM-650 |
2.5.17.2 |
Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98 |
|
IPC |
TM-650 |
2.5.15B |
Characteristic Impedance Flat Cables (Unbalanced)--7/84 |
|
IPC |
TM-650 |
2.5.19A |
Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 |
|
IPC |
TM-650 |
2.5.19.1A |
Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84 |
|
IPC |
TM-650 |
2.5.21A |
Digital Unbalanced Crosstalk, Flat Cable--3/84 |
|
IPC |
TM-650 |
2.5.24 |
Conductor Resistance, Flexible Flat Cable--6/79 |
|
IPC |
TM-650 |
2.5.25A |
Dielectric Withstand Voltage Flexible Fat Cable--11/85 |
|
IPC |
TM-650 |
2.5.26A |
Insulation Resistance Flexible Flat Cable--11/85 |
|
IPC |
TM-650 |
2.5.27 |
Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79 |
|
IPC |
TM-650 |
2.5.28A |
Q Resonance, Flexible Printed Wiring Materials--4/88 |
|
IPC |
TM-650 |
2.5.30 |
Balanced and Unbalanced Cable Attenuation Measurements--12/87 |
|
IPC |
TM-650 |
2.5.31 |
Current Leakage (Through Overglaze Films)--12/87 |
|
IPC |
TM-650 |
2.5.32 |
Resistance Test, Plated Through-Holes--12/87 |
|
IPC |
TM-650 |
2.5.33 |
Measurement of Electrical Overstress from Soldering Hand Tools--11/98 |
|
IPC |
TM-650 |
2.5.33.1 |
Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98 |
|
IPC |
TM-650 |
2.5.33.2 |
Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98 |
|
IPC |
TM-650 |
2.5.33.3 |
Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98 |
|
IPC |
TM-650 |
2.5.33.4 |
Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98 |
|
IPC |
TM-650 |
2.6.1E |
Fungus Resistance Printed Wiring Materials--8/97 |
|
IPC |
TM-650 |
2.6.2C |
Water Absorption, Flexible Printed Wiring--5/98 |
|
IPC |
TM-650 |
2.6.2.1A |
Water Absorption, Metal Clad Plastic Laminates--5/86 |
|
IPC |
TM-650 |
2.6.3E |
Moisture and Insulation Resistance, Printed Boards--8/97 |
|
IPC |
TM-650 |
2.6.3.1C |
Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98 |
|
IPC |
TM-650 |
2.6.3.2B |
Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 |
|
IPC |
TM-650 |
2.6.3.3A |
Surface Insulation Resistance, Fluxes--1/95 |
|
IPC |
TM-650 |
2.6.4A |
Outgassing, Printed Boards--8/97 |
|
IPC |
TM-650 |
2.6.5C |
Physical Shock, Multilayer Printed Wiring--8/97 |
|
IPC |
TM-650 |
2.6.6B |
Temperature Cycling, Printed Wiring Board--12/87 |
|
IPC |
TM-650 |
2.6.7A |
Thermal Shock and Continuity, Printed Board--8/97 |
|
IPC |
TM-650 |
2.6.7.1 |
Thermal Shock--Polymer Solder Mask Coatings--2/88 |
|
IPC |
TM-650 |
2.6.7.2A |
Thermal Shock, Continuity and Microsection, Printed Board--8/97 |
|
IPC |
TM-650 |
2.6.8D |
Thermal Stress, Plated Through-Holes--3/98 |
|
IPC |
TM-650 |
2.6.8.1 |
Thermal Stress, Laminate--9/91 |
|
IPC |
TM-650 |
2.6.9A |
Vibration, Rigid Printed Wiring--8/97 |
|
IPC |
TM-650 |
2.6.9.1 |
Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95 |
|
IPC |
TM-650 |
2.6.9.2 |
Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95 |
|
IPC |
TM-650 |
2.6.10A |
X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97 |
|
IPC |
TM-650 |
2.6.11B |
Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88 |
|
IPC |
TM-650 |
2.6.12 |
Temperature Testing, Flexible Flat Cable--6/79 |
|
IPC |
TM-650 |
2.6.13 |
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85 |
|
IPC |
TM-650 |
2.6.14A |
Resistance to Electrochemical Migration, Polymer Solder Mask--8/87 |
|
IPC |
TM-650 |
2.6.15B |
Corrosion, Flux--1/95 |
|
IPC |
TM-650 |
2.6.16 |
Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85 |
|
IPC |
TM-650 |
2.6.16.1 |
Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98 |
|
IPC |
TM-650 |
2.6.17 |
Hydrolitic Stability, Flexible Printed Wiring Material--12/82 |
|
IPC |
TM-650 |
2.6.15A |
Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 |
|
IPC |
TM-650 |
2.6.19 |
Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87 |
|
IPC |
TM-650 |
2.6.20A |
Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95 |
|
IPC |
TM-650 |
2.6.21 |
Service Temperature of Flexible Printed Wiring--12/88 |
|
IPC |
TM-650 |
2.6.22 |
Superseded by J-STD-035 |
|
IPC |
TM-650 |
2.6.23 |
Test Procedure for Steam Ager Temperature Repeatability--7/93 |
|
Defense Dept. |
MIL-STD-883E |
1001 |
Barometric pressure, reduced (altitude operation) |
|
Defense Dept. |
MIL-STD-883E |
1002 |
Immersion |
|
Defense Dept. |
MIL-STD-883E |
1003 |
Insulation resistance |
|
Defense Dept. |
MIL-STD-883E |
1004.7 |
Moisture resistance |
|
Defense Dept. |
MIL-STD-883E |
1005.8 |
Steady state life |
|
Defense Dept. |
MIL-STD-883E |
1006 |
Intermittent life |
|
Defense Dept. |
MIL-STD-883E |
1007 |
Agree life |
|
Defense Dept. |
MIL-STD-883E |
1008.2 |
Stabilization bake |
|
Defense Dept. |
MIL-STD-883E |
1009.8 |
Salt atmosphere (corrosion) |
|
Defense Dept. |
MIL-STD-883E |
1010.7 |
Temperature cycling |
|
Defense Dept. |
MIL-STD-883E |
1011.9 |
Thermal shock |
|
Defense Dept. |
MIL-STD-883E |
1012.1 |
Thermal characteristics |
|
Defense Dept. |
MIL-STD-883E |
1013 |
Dew point |
|
Defense Dept. |
MIL-STD-883E |
1014.1 |
Seal |
|
Defense Dept. |
MIL-STD-883E |
1015.9 |
Burn-in test |
|
Defense Dept. |
MIL-STD-883E |
1016 |
Life/reliability characterization tests |
|
Defense Dept. |
MIL-STD-883E |
1017.2 |
Neutron irradiation |
|
Defense Dept. |
MIL-STD-883E |
1015.2 |
Internal water-vapor content |
|
Defense Dept. |
MIL-STD-883E |
1019.4 |
Ionizing radiation (total dose) test procedure |
|
Defense Dept. |
MIL-STD-883E |
1020.1 |
Dose rate induced latchup test procedure |
|
Defense Dept. |
MIL-STD-883E |
1021.2 |
Dose rate upset testing of digital microcircuits |
|
Defense Dept. |
MIL-STD-883E |
1022 |
Mosfet threshold voltage |
|
Defense Dept. |
MIL-STD-883E |
1023.2 |
Dose rate response of linear microcircuits |
|
Defense Dept. |
MIL-STD-883E |
1030.1 |
Preseal burn-in |
|
Defense Dept. |
MIL-STD-883E |
1031 |
Thin film corrosion test |
|
Defense Dept. |
MIL-STD-883E |
1032.1 |
Package induced soft error test procedure (due to alpha particles) |
|
Defense Dept. |
MIL-STD-883E |
1033 |
Endurance life test |
|
Defense Dept. |
MIL-STD-883E |
1034 |
Die penetrant test (for plastic devices) |
|
Defense Dept. |
MIL-STD-883E |
2001.2 |
Constant acceleration |
|
Defense Dept. |
MIL-STD-883E |
2002.3 |
Mechanical shock |
|
Defense Dept. |
MIL-STD-883E |
2003.7 |
Solderability |
|
Defense Dept. |
MIL-STD-883E |
2004.5 |
Lead integrity |
|
Defense Dept. |
MIL-STD-883E |
2005.2 |
Vibration fatigue |
|
Defense Dept. |
MIL-STD-883E |
2006.1 |
Vibration noise |
|
Defense Dept. |
MIL-STD-883E |
2007.2 |
Vibration, variable frequency |
|
Defense Dept. |
MIL-STD-883E |
2008.1 |
Visual and mechanical |
|
Defense Dept. |
MIL-STD-883E |
2009.9 |
External visual |
|
Defense Dept. |
MIL-STD-883E |
2010.10 |
Internal visual (monolithic) |
|
Defense Dept. |
MIL-STD-883E |
2011.7 |
Bond strength (destructive bond pull test) |
|
Defense Dept. |
MIL-STD-883E |
2012.7 |
Radiography |
|
Defense Dept. |
MIL-STD-883E |
2013.1 |
Internal visual inspection for DPA |
|
Defense Dept. |
MIL-STD-883E |
2014 |
Internal visual and mechanical |
|
Defense Dept. |
MIL-STD-883E |
2015.11 |
Resistance to solvents |
|
Defense Dept. |
MIL-STD-883E |
2016 |
Physical dimensions |
|
Defense Dept. |
MIL-STD-883E |
2017.7 |
Internal visual (hybrid) |
|
Defense Dept. |
MIL-STD-883E |
2015.3 |
Scanning electron microscope (SEM) inspection of metallization |
|
Defense Dept. |
MIL-STD-883E |
2019.5 |
Die shear strength |
|
Defense Dept. |
MIL-STD-883E |
2020.7 |
Particle impact noise detection test |
|
Defense Dept. |
MIL-STD-883E |
2021.3 |
Glassivation layer integrity |
|
Defense Dept. |
MIL-STD-883E |
2022.2 |
Wetting balance solderability |
|
Defense Dept. |
MIL-STD-883E |
2023.5 |
Nondestructive bond pull |
|
Defense Dept. |
MIL-STD-883E |
2024.2 |
Lid torque for glass-frit-sealed packages |
|
Defense Dept. |
MIL-STD-883E |
2025.4 |
Adhesion of lead finish |
|
Defense Dept. |
MIL-STD-883E |
2026 |
Random vibration |
|
Defense Dept. |
MIL-STD-883E |
2027.2 |
Substrate attach strength |
|
Defense Dept. |
MIL-STD-883E |
2028.4 |
Pin grid package destructive lead pull test |
|
Defense Dept. |
MIL-STD-883E |
2029 |
Ceramic chip carrier bond strength |
|
Defense Dept. |
MIL-STD-883E |
2030 |
Ultrasonic inspection of die attach |
|
Defense Dept. |
MIL-STD-883E |
2031.1 |
Flip chip pull-off test |
|
Defense Dept. |
MIL-STD-883E |
2032.1 |
Visual inspection of passive elements |
|
Defense Dept. |
MIL-STD-883E |
2035 |
Ultrasonic inspection of TAB bonds |
|
Defense Dept. |
MIL-STD-883E |
3001.1 |
Drive source, dynamic |
|
Defense Dept. |
MIL-STD-883E |
3002.1 |
Load conditions |
|
Defense Dept. |
MIL-STD-883E |
3003.1 |
Delay measurements |
|
Defense Dept. |
MIL-STD-883E |
3004.1 |
Transition time measurements |
|
Defense Dept. |
MIL-STD-883E |
3005.1 |
Power supply current |
|
Defense Dept. |
MIL-STD-883E |
3006.1 |
High level output voltage |
|
Defense Dept. |
MIL-STD-883E |
3007.1 |
Low level output voltage |
|
Defense Dept. |
MIL-STD-883E |
3008.1 |
Breakdown voltage, input or output |
|
Defense Dept. |
MIL-STD-883E |
3009.1 |
Input current, low level |
|
Defense Dept. |
MIL-STD-883E |
3010.1 |
Input current, high level |
|
Defense Dept. |
MIL-STD-883E |
3011.1 |
Output short circuit current |
|
Defense Dept. |
MIL-STD-883E |
3012.1 |
Terminal capacitance |
|
Defense Dept. |
MIL-STD-883E |
3013.1 |
Noise margin measurements for digital microelectronic devices |
|
Defense Dept. |
MIL-STD-883E |
3014 |
Functional testing |
|
Defense Dept. |
MIL-STD-883E |
3015.7 |
Electrostatic discharge sensitivity classification |
|
Defense Dept. |
MIL-STD-883E |
3016 |
Activation time verification |
|
Defense Dept. |
MIL-STD-883E |
3017 |
Microelectronics package digital signal transmission |
|
Defense Dept. |
MIL-STD-883E |
3015 |
Crosstalk measurements for digital microelectronic device packages |
|
Defense Dept. |
MIL-STD-883E |
3019.1 |
Ground and power supply impedance measurements for digital microelectronics device packages |
|
Defense Dept. |
MIL-STD-883E |
3020 |
High impedance (off-state) low-level output leakage current |
|
Defense Dept. |
MIL-STD-883E |
3021 |
High impedance (off-state) high-level output leakage current |
|
Defense Dept. |
MIL-STD-883E |
3022 |
Input clamp voltage |
|
Defense Dept. |
MIL-STD-883E |
3023 |
Static latch-up measurements for digital CMOS microelectronic devices |
|
Defense Dept. |
MIL-STD-883E |
3024 |
Simultaneous switching noise measurements for digital microelectronic devices |
|
Defense Dept. |
MIL-STD-883E |
4001.1 |
Input offset voltage and current and bias current |
|
Defense Dept. |
MIL-STD-883E |
4002.1 |
Phase margin and slew rate measurements |
|
Defense Dept. |
MIL-STD-883E |
4003.1 |
Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio |
|
Defense Dept. |
MIL-STD-883E |
4004.1 |
Open loop performance |
|
Defense Dept. |
MIL-STD-883E |
4005.1 |
Output performance |
|
Defense Dept. |
MIL-STD-883E |
4006.1 |
Power gain and noise figure |
|
Defense Dept. |
MIL-STD-883E |
4007 |
Automatic gain control range |
|
Defense Dept. |
MIL-STD-883E |
5001 |
Parameter mean value control |
|
Defense Dept. |
MIL-STD-883E |
5002.1 |
Parameter distribution control |
|
Defense Dept. |
MIL-STD-883E |
5003 |
Failure analysis procedures for microcircuits |
|
Defense Dept. |
MIL-STD-883E |
5004.10 |
Screening procedures |
|
Defense Dept. |
MIL-STD-883E |
5005.13 |
Qualification and quality conformance procedures |
|
Defense Dept. |
MIL-STD-883E |
5006 |
Limit testing |
|
Defense Dept. |
MIL-STD-883E |
5007.6 |
Wafer lot acceptance |
|
Defense Dept. |
MIL-STD-883E |
5008.8 |
Test procedures for hybrid and multichip microcircuits |
|
Defense Dept. |
MIL-STD-883E |
5009.1 |
Destructive physical analysis |
|
Defense Dept. |
MIL-STD-883E |
5010.3 |
Test procedures for custom monolithic microcircuits |
|
Defense Dept. |
MIL-STD-883E |
5011.4 |
Evaluation and acceptance procedures for polymeric adhesives. |
|
Defense Dept. |
MIL-STD-883E |
5012.1 |
Fault coverage measurement for digital microcircuits. |
|
Defense Dept. |
MIL-STD-883E |
5013 |
Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers. |