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What's New - June 2010
Tin Whisker Risk Assessment for Printed Circuit Boards
Metal whiskers present a reliability risk, but assessing that risk can be difficult. CALCE has been working with clients to conduct effective tin whisker risk evaluations. Using data sets of measured whisker growth and custom software, CALCE investigators can quantify the probability of failure. The calceTinWhiskerRiskCalculator software is used to define potential risk locations and provide probability of failure estimations.
CALCE recently integrated the calceTinWhiskerRiskCalculator into the calcePWA software. The updated software allows users to conduct tin whisker risk assessments for printed wiring assemblies that include an evaluation of the overall life expectancy for printed circuit cards under examination. For more information, please contact Dr. Michael Osterman at osterman@calce.umd.edu.
Fourth International Symposium on Tin Whisker – Register Now
From June 23-24, CALCE, in collaboration with the Institute of Scientific and Industrial Research (ISIR) at Osaka University, Japan, will host the Fourth International Symposium on Tin Whiskers at the University of Maryland, College Park. With over 20 technical presentations, this symposium will cover the latest research on tin whisker growth, failure mitigation strategies, and risk evaluation methods. Registration opened April 5th and will continue while seating is available. The registration fee is $500 USD and CALCE Consortium members will receive a 20% discount. For more information on the symposium, please contact Dr. Michael Osterman at osterman@calce.umd.edu, or visit the information page here.
Prof Pecht Elected to SAE Fellow, Wins CPMT Technical Award
In April, CALCE Founder and Director Dr. Michael G. Pecht was elected Fellow of the Society of Automotive Engineers (SAE) at the SAE 2010 World Congress in Detroit, Michigan. With this election, Pecht joined an illustrious community of engineers and researchers who have attained the distinction of Fellow since the inception of the SAE in 1975. The SAE bestows the honorary grade of Fellow on members "who have made a significant impact on society’s mobility technology through leadership, research, and innovation." Pecht’s contributions to mobility technology include his development of the physics-of-failure (PoF) approach to electronics reliability in transportation systems. For more information on Dr. Pecht’s election to SAE Fellow, please click here.
Dr. Pecht will also receive the IEEE Components Packaging and Manufacturing Technology (CPMT) Society's 2010 Exceptional Technical Achievement Award at the 60th Electronic Components and Technology Conference, to be held June 1-4 in Las Vegas, NV. Dr. Pecht was selected for this award in recognition of over 20 years of contributions to the field of electronics reliability. The CPMT Exceptional Technical Achievement Award recognizes individual or group achievement in the fields of components, packaging, and manufacturing technology. For more information on the Dr. Pecht’s CPMT award, please click here.
CALCE Research Recognized
Education is the cornerstone of CALCE, and we are dedicated to providing a knowledge and resource base for the development of competitive electronic products and systems. CALCE is pleased to announce the recent recognition of our innovative work:
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Failure analysis is a difficult process, and destructive analysis may destroy evidence of root cause. CALCE has recently been recognized for its work on non-destructive evaluation approaches for identifying defective microvias. In November 2009, Cholmin Choi, a research assistant to Prof. Abhijit Dasgupta, won the 2009 American Society of Mechanical Engineers (ASME) International Mechanical Engineering Congress & Exposition Best Student Poster Award for his work on non-destructive evaluation of defective microvias.
- CALCE’s research assists our clients in developing robust portable electronic products. Under the direction of Prof. Dasgupta, Farbod Askari received the 2009 University of Maryland Department of Mechanical Engineering M.S. Thesis Award for his work on drop testing and simulation of complex electronic systems.
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Proper assessment of vibration and combined temperature cycling and vibration loading is critical for automotive and avionic systems. Dr. Michael Osterman and Prof. Abhijit Dasgutpa are pleased to announce that their collaboration with Yuxun Zhou and Gustavo Plaza, CALCE alumni and former research assistants, on Pb-free durability under combined vibration and temperature loading received the 2010 Maurice Simpson Technical Editors Award for Best Paper in the Journal for the Institute of Environmental Sciences and Technology.
- Solder is not the only way to form electrical interconnects. Recently, CALCE researchers have been recognized for their work on an alternative to solder: adhesively bonded flip chip interconnects. Koustav Sinha and Dan Farley were awarded Best Poster at the 2010 University of Maryland Mechanical Engineering Research Review Day.
For more information on these achievements, please contact Dr. Abhijit Dasgupta at dasgupta@calce.umd.edu.
Counterfeit Parts Symposium
CALCE and SMTA will hold the annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts at Honeywell’s Deer Valley facilities in Deer Valley, AZ, from June 8-11, 2010. The four-day event will include an enriching mix of presentations, technical sessions, workshops, and panel discussions on such topics as Physical & Materials Testing, Supply Chain Best Practices, Worldwide Intellectual Property Protection, and External Visual Inspection of Electronic Parts. Registration is now open and will continue until June 7. For more information on the symposium, please contact Melissa Serres at melissa@smta.org, or visit the information page here.
IMPACT 2010 – Papers Accepted until June 11
As a co-organizer of the 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2010) Conference, CALCE proudly invites its members and supporters to submit papers and presentations for this event. Abstracts will be accepted for IMPACT 2010 until June 11. IMPACT 2010 is the fifth conference organized by IEEE CPMT Taipei, ITRI, IMAPS Taiwan, National Tsing Hua University, SIPO and TPCA. At IMPACT 2010, researchers, engineers and experts from the packaging industry will gather to discuss developments and challenges in semiconductors, packaging, assembly and printed circuit board manufacturing. IMPACT 2010 will be held from October 20-22 at the Taipei Nangang Exhibition Center in Taipei, Taiwan. For more information on the IMPACT 2010 conference, please contact Prof. Michael Pecht at pecht@calce.umd.edu or visit the information page here.
Upcoming Webinars
June - Characterizing Lithium-Ion Battery Deterioration Factors
June 22, 11:00 am US EST
On June 22, the CALCE webinar series will begin with a seminar on Characterizing Lithium-Ion Battery Deterioration Factors, presented by Mr. Bhanu Sood, Director of the Test Services and Failure Analysis (TSFA) Laboratory. The seminar will provide a review of lithium-ion battery degradation behavior based on research from the CALCE TSFA Lab. Registration for the webinar is free to EPSC members, and $300 USD for non-members. For more information on the June webinar, or to register, contact Mr. Bhanu Sood at bpsood@calce.umd.edu, or visit the webinar information page here.
July - High-Sensitivity Warpage Measurement During the Assembly Process - Applicability and Limitations of Existing Methods
July 20, 2010 11:00am US EST
$300 USD for non-consortium members. Free for consortium members.
Non-Member Registration Form
On July 20, Prof. Bongtae Han will conduct a one-hour web seminar on High-Sensitivity Warpage Measurement during the Assembly Process. Prof. Han will address the many applications and limitations of existing methods of warpage measurement. Additionally, Prof. Han will review warpage measurement techniques implemented for packaging applications, with a special look at two recent developments in warpage measurement: far infrared Fizeau interferometry (FIFI) [1,2] and shadow moire with non-zero Talbot distance (SM-NT) [3,4]. Select results from each technique will be presented. Registration is $300 USD for non-members and free to EPSC members. For more information on the July webinar, please contact Prof. Bongtae Han at bthan@calce.umd.edu, or visit the webinar information page here. |
