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What's New - August 2010
Indian E-Waste Legislation Adds New Material Restrictions
In May 2010, the Government of India's Ministry of Environment and Forests proposed new e-waste policies to reduce hazardous waste and ensure the environmentally-sound disposal of electrical waste and electronic equipment. Similar in many ways to the European Union’s Waste in Electronic and Electrical Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) regulations, the proposed policies address the production-to-disposal life cycle of electronic equipment and include detailed instructions on handling electronic waste. Specifically, the proposed e-waste policies provide direction on threshold limits and disposal procedures for four heavy metals--lead, mercury, cadmium and hexavalent chromium--and sixteen (16) additional substances, including: copper beryllium alloys, tetrabromobisphenol-A (TBBPA), and Liquid Crystals. For some materials, a threshold limit has not been specified, and. In its current form, the policy document does not clearly state the measurement technique to be used for assessing content level, nor has it identified any exempt materials. A copy of the draft is available here. For more information on India’s new e-waste policies, please contact Dr. Michael Osterman at osterman@calce.umd.edu.
CALCE Top Article Downloads
As the world’s largest electronic products and systems research center, CALCE is proud to offer a wide collection of published papers, articles and conference proceedings through its Publication Archive. CALCE consortium members with an active CALCE web account are granted free access to the Publication Archive and non-members may sign up for a monthly subscription at $500 USD/month. With hundreds of visitors daily, CALCE's Publication Archive is one of the most visited areas on the CALCE website. Below is a list of the top three downloads from the Publication Archive for the last three months.
- Examination of Nickel Underlayer as a Tin Whisker Mitigator , Lyudmyla Panashchenko and Michael Osterman, Electronic Component and Technology Conference, May 2009.
- Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering, B. Sood, R. Sanapala, D. Das, M. Pecht, C. Huang, and M. Tsai, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, No. 2, pp. 98-111, April 2010
- A Multi-component and Multi-failure Mode Inspection Model Based on the Delay Time Concept, W. Wang, D. Banjevic, M. Pecht, Reliability Engineering and System Safety, Accepted, April 2010
For more information on the CALCE Publication Archive, please click here.
Proceedings from Tin Whisker and Counterfeit Parts Symposia Now Online
Proceedings from the Fourth International Symposium on Tin Whiskers and the Symposium on Avoiding, Detecting and Preventing Counterfeit Parts are now available online.
The Symposium on Avoiding, Detecting and Preventing Counterfeit Parts (ADPCP 2010 – West), held at the Honeywell Facilities in Deer Valley, AZ from June, was the first Counterfeit Parts symposia to emanate from a west coast venue. Researchers and industry experts in electronics manufacturing gathered at the ADPCP–West symposium to discuss the latest developments in counterfeit parts research, policy and prevention. With over 20 presentations, including keynotes by Stan McCoy and Belva Martin, and two days of interactive, hands-on workshops, attendees participated in a breadth of lively discussion over the present and future of this crucial issue. Presentations from this symposium are available at http://www.calce.umd.edu/symposiums/adpcp2010_presentations.html. Access to presentations is free to attendees and current members of the CALCE EPS Consortium. Non-members and non-attendees must register for a CALCE articles account. The non-member/attendee fee for a CALCE articles account is $500 per month. For more information on ADPCP-West, please contact Dr. Diganta Das at digudas@calce.umd.edu.
This June, CALCE and The Institute of Scientific and Industrial Research (ISIR), Osaka University, hosted the Fourth International Symposium on Tin Whiskers at the University of Maryland’s Samuel Riggs Alumni Center in College Park, MD. Welcoming more than 100 members of electronics manufacturing industry and research communities, the symposium addressed the state of tin whisker research as well as current innovations fueling future tin whisker research. This year’s symposium boasted over 30 presentations, presented by experts in the field from a number of leading research and industry organizations, including Sandia National Labs, Purdue University and NASA. Presentations from the symposium are available at http://www.calce.umd.edu/symposiums/ISTW2010.htm. Access to presentations is free to attendees and current members of the CALCE EPS Consortium. Non-members and non-attendees must register for a CALCE articles account. The non-member/attendee fee for a CALCE articles account is $500 per month. For more information on ISTW 2010, please contact Dr. Michael Osterman at osterman@calce.umd.edu.
CALCE at ECTC
CALCE faculty, staff, and graduates were featured prominently at the 60th Electronic Components and Technology Conference (ECTC) in Las Vegas, Nevada, on June 1-4, 2010. The ECTC is the premier international packaging, components, and microelectronics systems technology conference. Current CALCE faculty and staff presented the paper titled “An Investigation into a Low Insulation Resistance Failure of Multilayer Ceramic Capacitors.” Dr. Ravi Doraiswami presented on “Energy Harvesting using RF MEMS.” A number of Prof. Pecht’s former CALCE students attended the ECTC 2010, including Dr. Yuchul Hwang, who presented on “Accelerated Preconditioning of Stack Die Packages,” and Prof. Pradeep Lall from Auburn University was part of the Programming Committee for Modeling and Simulation.
Prof. Michael Pecht (center) with CALCE alumni Dr. Yuchul Hwang (left) and Dr. Anupam Choubey (right).
CALCE’s strong showing at ECTC was capped by Prof. Pecht receiving the 2010 Exceptional Technical Achievement Award from the IEEE Components Packaging and Manufacturing Technology (CPMT) Society. This award recognizes individual achievement in the fields of components, packaging, and manufacturing technology. Prof. Pecht received the award in recognition of over 20 years of contributions to the area of electronics reliability, including his development of the field of prognostics for electronics. For more information on CALCE’s presence at ECTC, contact Prof. Pecht at pecht@calce.umd.edu.
CALL FOR ABSTRACTS
Counterfeit Electronic Parts and Electronic Supply Chain Symposium - Nov/Dec 2010
CALCE and SMTA are pleased to announce the east coast venue for the Symposium on Counterfeit Electronic Parts. The program will be held November 30 – December 2 at the University of Maryland in College Park, MD. This symposium will address viable solutions to the challenge of counterfeit parts under development by all sectors of industry. Our goal is to provide the most effective strategies for solving tomorrow’s counterfeit parts problems today. This symposium will be of particular value to senior management, supply chain managers, component engineers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies addressing the issue. Topics will include:
- Supply chain management tools to mitigate counterfeit part risks
- Inspections tools and techniques for detecting counterfeit parts
- Authentication techniques for securing electronic part supply chain
- And much more…
If interested in presenting at this winter’s symposium, please submit abstracts (300 word max.) on any relevant topics to Dr. Diganta Das via email to diganta@umd.edu no later than August 20th. Presentations will be due November 1st. Watch for additional symposium information at www.smta.org/counterfeit. Don’t miss this opportunity to network with government agencies and peers who are solving the counterfeit problem!
CALCE Events On the Horizon
 Failure Analysis Course
Date: September 14-17, 2010; Venue: CALCE Failure Analysis Lab, University of Maryland, College Park, MD
CALCE Test Services will hold a four-day short course on Failure Analysis techniques at the CALCE Failure Analysis Lab on the University of Maryland College Park campus from September 14-17. Sponsored by CALCE and Buehler (the world's premier manufacturer of scientific equipment and supplies for use in materials analysis), this intensive short course will offer attendees the opportunity to participate in lectures, demonstrations, and hands-on laboratory tasks relating to failure analysis methodology, specimen preparation, and materials analysis techniques for electronics assemblies, components, and devices. Attendees may submit samples for use in laboratory and hands-on demonstrations, up to three weeks before the course. Registration for the course is $2500 USD per individual attendee. For more information on the short course, contact Bhanu Sood at bpsood@calce.umd.edu, or visit the information page here.
CALCE Short Course: China’s Electronics Industry
Date: Oct 18, 2010; Time: 9:00am-12:00pm; Venue: University of Maryland, College Park
CALCE is pleased to announce a short course on China's Electronics Industry hosted by Michael Pecht and Leonard Zuga, authors of China’s Electronics Industry, 2009 Edition. Attendees of this half‐day course will learn how to successfully engage the Chinese electronics industry, which is rapidly emerging as the world’s leader at all levels, from research and design to manufacturing. The course will be held at the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, on Monday, October 18, 2010, from 9:00 a.m. to 12:00 p.m. The cost is $150 per attendee. Each attendee will receive a free copy of China’s Electronics Industry, 2009 Edition. For more information, please click here or contact Joan Lee at joanyuan@calce.umd.edu.
CALCE Short Course: Impact of Free Air Cooling on Information and Communication Technology Equipment
Date: Oct 18, 2010; Venue: University of Maryland, College Park
On Oct 18, 2010, CALCE will offer a one-day course on the “Impact of Free Air Cooling on Information and Communication Technology Equipment.” This course will cover several topics related to fresh air cooling for information and communication technology purposes, including: fresh air cooling implementation, risks to equipment performance, and limitations of “traditional” qualification methods. A wealth of beneficial information on fresh air cooling will be available to professionals considering the use of fresh air cooling to improve ICT efficiency. For more information, please click here or contact Dr. Diganta Das at digudas@calce.umd.edu.
CALCE EPSC Fall Technical Review and Project Kickoff Meetings
Date: October 19-20, 2010; Venue: Stamp Student Union, University of Maryland, College Park, MD
CALCE’s Fall Technical Review and Project Planning Meetings are scheduled for October 19-20, 2010 at the Stamp Student Union on the University of Maryland's College Park campus. The meeting will provide EPSC members with an opportunity to review FY10 research findings and discuss FY11 Research Projects. All current members of the EPS Consortium are invited to attend. Invited non-member guests must pay a $1,500 registration fee. Organizations interested in becoming CALCE EPSC members and wishing to attend the meeting should contact Michael Osterman at osterman@calce.umd.edu. For information on the Fall Review and Project Kickoff meetings, please click here.
Upcoming Webinars
 August 24, 2010, 11:00 am US EST
$300 for non-consortium members. Free for consortium members
On August 24, the CALCE web seiminar series will highlight recent CALCE research on Tin Whiskers with a presentation by Dr. Michael Osterman. The seminar will provide a review of present status of CALCE research related to tin whiskers. Dr. Osterman will address assessment of failure risk presented by the use of tin finished materials in electronic hardware. Additionally, Dr. Osterman will discuss the effectiveness of conformal coating and potential of electrical arcing will be discussed. Registration for the webinar is free to EPSC members, and $300 USD for non-members. For more information on the August webinar, please contact Dr. Michael Osterman at osterman@calce.umd.edu or visit the webinar information page here. |
